Abstract: The method for manufacturing printed circuit boards includes providing through hole vias in a non-conductive substrate at given coordinates in a printed circuit board topology, then an adhesive undercoat, a conductive layer and a metal mask layer are applied, in a single process, to the surface of the substrate and to the walls of the vias. A soluble protective layer is applied to the mask layer and to the walls of the vias, then a circuit board pattern is formed by laser evaporation, then the conductive layer and the adhesive undercoat in the regions exposed by laser evaporation are removed by selective chemical etching. The protective layer is removed from the regions that are not exposed by laser evaporation and the vias, then the metal mask layer is removed. Finally, a protective barrier layer and a layer that provides solderability and/or weldability of the surface are applied.

Abstract: The method for producing conductive tracks includes applying continuous metallization layers to a non-conductive substrate, forming a metallization pattern, and applying to the formed tracks a protective barrier layer and a layer for soldering and/or welding elements of parts to the conductive tracks. The continuous metallization layers are applied by consecutively applying an adhesive layer, a conductive layer, and a metal layer, acting as a mask, to the non-conductive substrate. To form the metallization pattern, a mask is formed by laser ablation on sections of the metal layer not occupied by conductive tracks, then selective chemical etching removes the conductive layer and adhesive sublayer from the exposed sections, and selective chemical etching removes the mask, after which the protective barrier layer and layer for soldering and/or welding are applied.

Abstract: The invention forms conductive tracks in electronics and microelectronics for the commutation of electronic circuits and semiconductor devices. The method for producing conductive tracks includes applying continuous metallization layers to a non-conductive substrate, forming a metallization pattern, and applying to the formed tracks a protective barrier layer and a layer for soldering and/or welding elements of parts to the conductive tracks. The continuous metallization layers are applied by consecutively applying an adhesive layer, a conductive layer, and a metal layer, acting as a mask, to the non-conductive substrate. To form the metallization pattern, a mask is formed by laser ablation on sections of the metal layer not occupied by conductive tracks, then selective chemical etching removes the conductive layer and adhesive sublayer from the exposed sections, and selective chemical etching removes the mask, after which the protective barrier layer and layer for soldering and/or welding are applied.