Abstract: Users of a software system are provided the opportunity to participate as members of a peer-to-peer support community for the software system. Profile data is obtained indicating areas of expertise associated with members and each member can designate their status as active or non-active. Context criteria data indicating a context status for each active status member is generated. The profile data and the context criteria data for each active status member of the peer-to-peer support community is used to identify one or more sub-sets of active status members of the peer-to-peer support community who share a common context to dynamically match one or more active status members within the peer-to-peer support community and allow the matched members to provide support to each other through the software system.

Abstract: An embedded resistor and capacitor circuit and fabrication method is provided. The circuit includes a substrate, a conductive foil laminated to the substrate, and a thick film dielectric material disposed on the conductive foil. One or more thick film electrodes are formed on the dielectric material and a thick film resistor is formed at least partially contacting the thick film electrodes. A capacitor is formed by an electrode and the conductive foil. The electrodes serve as terminations for the resistor and capacitor.

Abstract: An inductor and method of containing a magnetic field is provided. The inductor includes a first set of layers wound in a first predetermined direction, wherein each layer of the first set of layers is electrically connected to one another, and a second set of layers wound in a second predetermined direction, wherein each layer of the second set of layers is electrically connected to one another and the first set of layers, and the second set of layers is between a top layer and a bottom layer, such that the top layer forms a first pair with a first layer of the second set of layers, and the bottom layer forms a second pair with a second layer of the second set of layers so that the magnetic field is substantially contained, such as to remain substantially within a gap defined between each layer of the pairs of layers.

Abstract: An embedded resistor and capacitor circuit and fabrication method is provided. The circuit includes a substrate, a conductive foil laminated to the substrate, and a thick film dielectric material disposed on the conductive foil. One or more thick film electrodes are formed on the dielectric material and a thick film resistor is formed at least partially contacting the thick film electrodes. A capacitor is formed by an electrode and the conductive foil. The electrodes serve as terminations for the resistor and capacitor.

Abstract: An electronics assembly is provided including a circuit board substrate having a top surface and a bottom surface and a plurality of thermal conductive vias extending from the top surface to the bottom surface. At least one electronics package is mounted to the top surface of the substrate. A heat sink device is in thermal communication with the bottom surface of the substrate. Thermal conductive vias are in thermal communication to pass thermal energy from the at least one electronics package to the heat sink. At least some of the thermal conductive vias are formed extending from the top surface to the bottom surface of the substrate at an angle.

Abstract: A method for forming a leadframe assembly is provided. The method includes the steps of providing a sheet of leadframe material and depositing a brazing alloy on a first surface of the sheet. The method also includes the steps of placing one or more substrates on the first surface of the sheet and in contact the brazing alloy, and heating the brazing alloy to bond the substrate to the first surface of the sheet.

Abstract: An electronics assembly is provided including a circuit board substrate having a top surface and a bottom surface and a plurality of thermal conductive vias extending from the top surface to the bottom surface. At least one electronics package is mounted to the top surface of the substrate. A heat sink device is in thermal communication with the bottom surface of the substrate. Thermal conductive vias are in thermal communication to pass thermal energy from the at least one electronics package to the heat sink. At least some of the thermal conductive vias are formed extending from the top surface to the bottom surface of the substrate at an angle.