Patents by Inventor Aleksey Sergeyevich KHENKIN
Aleksey Sergeyevich KHENKIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10972848Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.Type: GrantFiled: October 10, 2019Date of Patent: April 6, 2021Assignee: Cirrus Logic, Inc.Inventors: Jean Pierre Lasseuguette, Aleksey Sergeyevich Khenkin, Axel Thomsen
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Patent number: 10735868Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.Type: GrantFiled: November 2, 2018Date of Patent: August 4, 2020Assignee: Cirrus Logic, Inc.Inventors: Rkia Achehboune, Dimitris Drogoudis, Roberto Brioschi, Aleksey Sergeyevich Khenkin, David Patten
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Patent number: 10696545Abstract: The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.Type: GrantFiled: June 13, 2018Date of Patent: June 30, 2020Assignee: Cirrus Logic, Inc.Inventors: Aleksey Sergeyevich Khenkin, David Patten
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Publication number: 20200045485Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.Type: ApplicationFiled: October 10, 2019Publication date: February 6, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Jean Pierre LASSEUGUETTE, Aleksey Sergeyevich KHENKIN, Axel THOMSEN
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Patent number: 10511923Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.Type: GrantFiled: March 28, 2018Date of Patent: December 17, 2019Assignee: Cirrus Logic, Inc.Inventors: Jean Pierre Lasseuguette, Aleksey Sergeyevich Khenkin, Axel Thomsen
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Patent number: 10477322Abstract: The application describes a MEMS transducer comprising: a substrate; a primary membrane supported in a fixed relation relative to the substrate and a secondary membrane provided in a plane overlying the primary membrane. The secondary membrane is mechanically coupled to the primary membrane by a substantially rigid coupling structure. A rigid support plate may be interposed between the primary and secondary membranes.Type: GrantFiled: September 19, 2017Date of Patent: November 12, 2019Assignee: Cirrus Logic, Inc.Inventors: Aleksey Sergeyevich Khenkin, Tsjerk Hans Hoekstra
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Patent number: 10469956Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.Type: GrantFiled: December 22, 2017Date of Patent: November 5, 2019Assignee: Cirrus Logic, IncInventors: Aleksey Sergeyevich Khenkin, David Patten, Dimitris Drogoudis
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Publication number: 20190158962Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.Type: ApplicationFiled: November 2, 2018Publication date: May 23, 2019Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Rkia ACHEHBOUNE, Dimitris DROGOUDIS, Roberto BRIOSCHI, Aleksey Sergeyevich KHENKIN, David PATTEN
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Publication number: 20190047847Abstract: A MEMS transducer configured to operate as a microphone, the MEMS transducer comprising a flexible membrane, the flexible membrane having a first surface and a second surface, wherein the first surface of the flexible membrane is fluidically isolated from the second surface of the flexible membrane. Also, a MEMS device comprising a MEMS transducer, an electronic device comprising a MEMS transducer and/or a MEMS device, and a method for forming a MEMS device.Type: ApplicationFiled: August 1, 2018Publication date: February 14, 2019Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Aleksey Sergeyevich KHENKIN, Tsjerk Hans HOEKSTRA, Colin Robert Jenkins
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Publication number: 20180362332Abstract: The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.Type: ApplicationFiled: June 13, 2018Publication date: December 20, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Aleksey Sergeyevich KHENKIN, David PATTEN
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Publication number: 20180288547Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.Type: ApplicationFiled: March 28, 2018Publication date: October 4, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Jean Pierre LASSEUGUETTE, Aleksey Sergeyevich KHENKIN, Axel THOMSEN
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Publication number: 20180279057Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.Type: ApplicationFiled: December 22, 2017Publication date: September 27, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Aleksey Sergeyevich KHENKIN, David PATTEN, Dimitris DROGOUDIS
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Publication number: 20180167744Abstract: The application describes a lid for a transducer package, wherein an interior surface of the lid is provided with a plurality of dimples. The dimples are provided in a ceiling surface of the lid or in a side-wall surface of the lid. The dimples may be arranged to form a regular array. The dimples serve to create a turbulent boundary layer to decouple the interior surface of lid from airflow arising inside the package chamber, thus alleviating noise.Type: ApplicationFiled: December 5, 2017Publication date: June 14, 2018Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.Inventors: Marek Sebastian Piechocinski, Roberto Brioschi, Rkia Achehboune, Aleksey Sergeyevich Khenkin
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Publication number: 20180152792Abstract: A MEMS transducer comprising: a flexible membrane, the flexible membrane comprising a first membrane electrode; a back plate, the back plate comprising a first back plate electrode; wherein the back plate is supported in a spaced relation with respect to the flexible membrane. The MEMS transducer is configured to provide electrical connections to the first membrane electrode and the first back plate electrode. The flexible membrane further comprises a second membrane electrode, the second membrane electrode being electrically isolated from the first membrane electrode, wherein the first membrane electrode and the second membrane electrode are arranged to reduce variation in electrostatic forces across the flexible membrane.Type: ApplicationFiled: November 29, 2017Publication date: May 31, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Tsjerk Hans HOEKSTRA, Axel THOMSEN, Colin Robert JENKINS, Aleksey Sergeyevich KHENKIN
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Publication number: 20180091906Abstract: The application describes a MEMS transducer comprising: a substrate; a primary membrane supported in a fixed relation relative to the substrate and a secondary membrane provided in a plane overlying the primary membrane. The secondary membrane is mechanically coupled to the primary membrane by a substantially rigid coupling structure. A rigid support plate may be interposed between the primary and secondary membranes.Type: ApplicationFiled: September 19, 2017Publication date: March 29, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Aleksey Sergeyevich KHENKIN, Tsjerk Hans HOEKSTRA