Patents by Inventor Aleksey Sergeyevich KHENKIN

Aleksey Sergeyevich KHENKIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10972848
    Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: April 6, 2021
    Assignee: Cirrus Logic, Inc.
    Inventors: Jean Pierre Lasseuguette, Aleksey Sergeyevich Khenkin, Axel Thomsen
  • Patent number: 10735868
    Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 4, 2020
    Assignee: Cirrus Logic, Inc.
    Inventors: Rkia Achehboune, Dimitris Drogoudis, Roberto Brioschi, Aleksey Sergeyevich Khenkin, David Patten
  • Patent number: 10696545
    Abstract: The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: June 30, 2020
    Assignee: Cirrus Logic, Inc.
    Inventors: Aleksey Sergeyevich Khenkin, David Patten
  • Publication number: 20200045485
    Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.
    Type: Application
    Filed: October 10, 2019
    Publication date: February 6, 2020
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Jean Pierre LASSEUGUETTE, Aleksey Sergeyevich KHENKIN, Axel THOMSEN
  • Patent number: 10511923
    Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: December 17, 2019
    Assignee: Cirrus Logic, Inc.
    Inventors: Jean Pierre Lasseuguette, Aleksey Sergeyevich Khenkin, Axel Thomsen
  • Patent number: 10477322
    Abstract: The application describes a MEMS transducer comprising: a substrate; a primary membrane supported in a fixed relation relative to the substrate and a secondary membrane provided in a plane overlying the primary membrane. The secondary membrane is mechanically coupled to the primary membrane by a substantially rigid coupling structure. A rigid support plate may be interposed between the primary and secondary membranes.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: November 12, 2019
    Assignee: Cirrus Logic, Inc.
    Inventors: Aleksey Sergeyevich Khenkin, Tsjerk Hans Hoekstra
  • Patent number: 10469956
    Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: November 5, 2019
    Assignee: Cirrus Logic, Inc
    Inventors: Aleksey Sergeyevich Khenkin, David Patten, Dimitris Drogoudis
  • Publication number: 20190158962
    Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 23, 2019
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Rkia ACHEHBOUNE, Dimitris DROGOUDIS, Roberto BRIOSCHI, Aleksey Sergeyevich KHENKIN, David PATTEN
  • Publication number: 20190047847
    Abstract: A MEMS transducer configured to operate as a microphone, the MEMS transducer comprising a flexible membrane, the flexible membrane having a first surface and a second surface, wherein the first surface of the flexible membrane is fluidically isolated from the second surface of the flexible membrane. Also, a MEMS device comprising a MEMS transducer, an electronic device comprising a MEMS transducer and/or a MEMS device, and a method for forming a MEMS device.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 14, 2019
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Aleksey Sergeyevich KHENKIN, Tsjerk Hans HOEKSTRA, Colin Robert Jenkins
  • Publication number: 20180362332
    Abstract: The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 20, 2018
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Aleksey Sergeyevich KHENKIN, David PATTEN
  • Publication number: 20180288547
    Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 4, 2018
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Jean Pierre LASSEUGUETTE, Aleksey Sergeyevich KHENKIN, Axel THOMSEN
  • Publication number: 20180279057
    Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.
    Type: Application
    Filed: December 22, 2017
    Publication date: September 27, 2018
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Aleksey Sergeyevich KHENKIN, David PATTEN, Dimitris DROGOUDIS
  • Publication number: 20180167744
    Abstract: The application describes a lid for a transducer package, wherein an interior surface of the lid is provided with a plurality of dimples. The dimples are provided in a ceiling surface of the lid or in a side-wall surface of the lid. The dimples may be arranged to form a regular array. The dimples serve to create a turbulent boundary layer to decouple the interior surface of lid from airflow arising inside the package chamber, thus alleviating noise.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 14, 2018
    Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
    Inventors: Marek Sebastian Piechocinski, Roberto Brioschi, Rkia Achehboune, Aleksey Sergeyevich Khenkin
  • Publication number: 20180152792
    Abstract: A MEMS transducer comprising: a flexible membrane, the flexible membrane comprising a first membrane electrode; a back plate, the back plate comprising a first back plate electrode; wherein the back plate is supported in a spaced relation with respect to the flexible membrane. The MEMS transducer is configured to provide electrical connections to the first membrane electrode and the first back plate electrode. The flexible membrane further comprises a second membrane electrode, the second membrane electrode being electrically isolated from the first membrane electrode, wherein the first membrane electrode and the second membrane electrode are arranged to reduce variation in electrostatic forces across the flexible membrane.
    Type: Application
    Filed: November 29, 2017
    Publication date: May 31, 2018
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Tsjerk Hans HOEKSTRA, Axel THOMSEN, Colin Robert JENKINS, Aleksey Sergeyevich KHENKIN
  • Publication number: 20180091906
    Abstract: The application describes a MEMS transducer comprising: a substrate; a primary membrane supported in a fixed relation relative to the substrate and a secondary membrane provided in a plane overlying the primary membrane. The secondary membrane is mechanically coupled to the primary membrane by a substantially rigid coupling structure. A rigid support plate may be interposed between the primary and secondary membranes.
    Type: Application
    Filed: September 19, 2017
    Publication date: March 29, 2018
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Aleksey Sergeyevich KHENKIN, Tsjerk Hans HOEKSTRA