Abstract: A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated includes a body whose terminal portion is substantially frustum-shaped. The body has a diametrical through hole which allows the passage of a copper wire for electrical bonding between the chip and the semiconductor device. The portion of the body that is adjacent a lower end of the through hole is flared, with a flaring diameter and a flaring angle which allows formation of a substantially flat annular peripheral region on a copper ball when the copper ball is placed at a lower end of the copper wire. The copper ball is deformed by the action of the capillary. The formation of the substantially flat annular peripheral region is independent of the position of the copper wire within the through hole of the body of the capillary.

Abstract: A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated, comprising a body whose terminal portion is substantially frustum-shaped, the body having a diametrical through hole which allows the passage of a copper wire for electrical bonding between the chip and the semiconductor device; the portion of the body that is adjacent to a lower end of the through hole is flared, with a flaring diameter and a flaring angle which allow to form a substantially flat annular peripheral region on a copper ball when the copper ball placed at a lower end of the copper wire is deformed by the action of the capillary, the formation of the substantially flat annular peripheral region being independent of the position of the copper wire within the through hole of the body of the capillary.