Patents by Inventor Alethea Pollock-Downer

Alethea Pollock-Downer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low application temperature hot melt adhesive
    Patent number: 10138398
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: November 27, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20180148615
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 31, 2018
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 9914857
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: March 13, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20150322302
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: Yuhong HU, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 9115299
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: August 25, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa Dejesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20140171586
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: February 24, 2014
    Publication date: June 19, 2014
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa Dejesus
  • Low application temperature hot melt adhesive
    Patent number: 8702900
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: April 22, 2014
    Assignee: Henkel US IP LCC
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, M. Cristina B. DeJesus
  • Low Application Temperature Hot Melt Adhesive
    Publication number: 20120149827
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: February 20, 2012
    Publication date: June 14, 2012
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, M. Cristina B. DeJesus