Abstract: A protective housing for a leadless chip carrier or plastic leaded chip carrier package includes a substantially rectangular-shaped solid body having a central cavity for receiving a chip package. The solid body is formed of four side portions. Beam members are pivotally connected on opposite sides of two of the four side portions of the solid body for retaining the package within the central cavity. A plurality of support members are formed on the interior surface of the two opposite side portions and the beam members for supporting the lower surface of the package at each of its four corners. The solid body is provided with two opposite chamfered corners for moving outwardly the beam members away from the central cavity so as to permit insertion or removal of the chip package from the central cavity.