Patents by Inventor Alex Arayata

Alex Arayata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230326829
    Abstract: The disclosure is directed to an electronic device with an embedded multi-layered heat slug. The electronic device in includes a substrate having a substrate body with a laminate layer. The substrate further includes a heat slug embedded within the substrate body. The heat slug includes a top layer having a first thermal conductivity and a first thermal expansion coefficient, a bottom layer having a second thermal conductivity and a second thermal expansion coefficient, and a core layer having a third thermal conductivity and a third thermal expansion coefficient. The third thermal conductivity is less than the first thermal conductivity and the second thermal conductivity, and the third thermal expansion coefficient is less than the first thermal expansion coefficient and the second thermal expansion coefficient. In certain embodiments, the top layer and the bottom layer comprise copper, and the core layer comprises copper-molybdenum.
    Type: Application
    Filed: September 29, 2021
    Publication date: October 12, 2023
    Inventors: Bo Zhao, Alex Arayata