Patents by Inventor Alex Bruderer

Alex Bruderer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for producing a plastic coating
    Patent number: 8715780
    Abstract: Method for producing a plastic layer having a layer thickness of less than 200 ?m on an upper side of a substrate includes the following steps: applying plastic powder to the substrate upper side by means of a powder scattering device, then cleaning the substrate underside, then melting the applied plastic powder in a furnace, as a result of which the plastic layer is formed on the substrate, and cooling the substrate, wherein the substrate is transported continuously from method step to method step.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: May 6, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Alex Bruderer, Jurgen Herbert, Max Hunziker, Michel Probst
  • COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY
    Publication number: 20130199825
    Abstract: Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).
    Type: Application
    Filed: October 21, 2011
    Publication date: August 8, 2013
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Alex Bruderer, Norbert Galster, Jurgen Kress, Michel Probst
  • METHOD AND DEVICE FOR PRODUCING A PLASTIC COATING
    Publication number: 20110293823
    Abstract: Method for producing a plastic layer having a layer thickness of less than 200 ?m on an upper side of a substrate, comprising the following steps: applying plastic powder to the substrate upper side by means of a powder scattering device, then cleaning the substrate underside, then melting the applied plastic powder in a furnace, as a result of which the plastic layer is formed on the substrate, and cooling the substrate, wherein the substrate is transported continuously from method step to method step.
    Type: Application
    Filed: February 19, 2010
    Publication date: December 1, 2011
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Alex Bruderer, Jurgen Herbert, Max Hunziker, Michel Probst