Patents by Inventor Alex Cayaban

Alex Cayaban has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ground vias for enhanced preamp heat release in hard disk drives
    Patent number: 8730684
    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: May 20, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Alex Cayaban, Szu-Han Hu, Yasunari Ooyabu, Martin John McCaslin
  • GROUND VIAS FOR ENHANCED PREAMP HEAT RELEASE IN HARD DISK DRIVES
    Publication number: 20120291260
    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions.
    Type: Application
    Filed: June 19, 2012
    Publication date: November 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Alex CAYABAN, Szu-Han HU, Yasunari OOYABU, Martin John MCCASLIN
  • Ground vias for enhanced preamp heat release in hard disk drives
    Patent number: 8233287
    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: July 31, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Alex Cayaban, Szu-Han Hu, Yasunari Ooyabu, Martin John McCaslin
  • GROUND VIAS FOR ENHANCED PREAMP HEAT RELEASE IN HARD DISK DRIVES
    Publication number: 20080186623
    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions.
    Type: Application
    Filed: February 1, 2008
    Publication date: August 7, 2008
    Inventors: Alex Cayaban, Szu-Han Hu, Yasunari Ooyabu, Martin John McCaslin