Abstract: A method for producing a cellulose fiber includes dissolving cellulose in a tetraalkylammonium hydroxide solution having a temperature of less than 45° C. to form a dissolution liquid and spinning the dissolution liquid by discharging the dissolution liquid formed by the dissolving into a coagulation liquid having a temperature of less than 15° C.

Abstract: A multi-layer printed circuit board includes a substrate having a first side and a second side opposite the first side, a central via pad disposed on the first side and having a plurality of central-extensions extending outwardly therefrom, a first via pad disposed on the first side and having at least one first-extension extending outwardly therefrom, a second via pad disposed on the first side and having at least one first-extension extending outwardly therefrom, wherein each central-extension has a first-connection-edge, wherein each first-extension has a second-connection-edge, wherein a first first-connection edge of a first central-extension faces a second-connection-edge of the first via pad, and a line perpendicular to the first first-connection edge and to the second-connection-edge of the first via pad forms an angle with a via-to-via axis line between the central via pad and the first via pad, and the angle is greater than a predetermined threshold angle.

Abstract: A multi-layer printed circuit board (PCB), includes a first plurality of layers, each having a plurality of signal traces disposed thereon, a second plurality of layers, each having a voltage plane disposed thereon, and a plurality of plated-through-hole vias disposed between a first surface of the multi-layer PCB and a second surface of the multi-layer PCB, wherein each plated-through-hole via includes a conductive barrel, wherein a first layer of the first plurality of layers includes a backdrill clearance region around a first plated-through-hole via in which no signal traces are disposed, and a first voltage plane on a first layer of the second plurality of layers is in contact with the conductive barrel of the first plated-through-hole via. In various embodiments, portions of the barrel of a plated-through-hole via are removed by, for example, backdrilling. Various embodiments advantageously provide improvements to signal-to-reference overlap, and to power plane current-carrying capacity.

Abstract: An electronic product includes a first printed circuit board (PCB) having one or more electronic components disposed thereon, a second PCB having castellated vias on a first edge thereof, and further having one or more capacitors disposed thereon, wherein the castellated vias on the first edge of the second PCB are mechanically and electrically coupled to the first PCB. The second PCB may be attached to the first PCB such that the second PCB is nominally orthogonal to the first PCB. The one or more capacitors may be disposed on a first side of the second PCB, or on the first and second sides of the second PCB. The capacitors may be attached to the second PCB by surface mount technology (SMT), and the second PCB may be attached to the first PCB at the vertically-oriented castellated vias by SMT.

Abstract: A multi-layer printed circuit board (PCB), includes a first plurality of layers, each having a plurality of signal traces disposed thereon, a second plurality of layers, each having a voltage plane disposed thereon, and a plurality of plated-through-hole vias disposed between a first surface of the multi-layer PCB and a second surface of the multi-layer PCB, wherein each plated-through-hole via includes a conductive barrel, wherein a first layer of the first plurality of layers includes a backdrill clearance region around a first plated-through-hole via in which no signal traces are disposed, and a first voltage plane on a first layer of the second plurality of layers is in contact with the conductive barrel of the first plated-through-hole via. In various embodiments, portions of the barrel of a plated-through-hole via are removed by, for example, backdrilling. Various embodiments advantageously provide improvements to signal-to-reference overlap, and to power plane current-carrying capacity.

Abstract: A printed circuit board for mounting electrical components thereupon include: a first side; a second side opposite the first side; electrical connection points disposed on the surface of an exterior edge of the printed circuit board; and wherein the exterior edge of the printed circuit board is between the first side and the second side. Further a method of manufacturing a printed circuit board for mounting electrical components thereupon includes the steps of disposing interconnect structures within the printed circuit board adjacent to at least one edge of the printed circuit board; and removing material from the printed circuit board edge to expose the interconnect structures such that the exposed interconnect structures correspond to a component connection footprint.

Abstract: An integrative approach combines a process of adsorption and ozonation which are used for removing the indigo dye from textile wastewater and the regeneration of adsorbent materials. Metal oxide modified adsorbents are efficient dye adsorbent materials for indigo dye wastewater and are used have been developed for adsorption process and regenerated by ozonation process. Upon the regeneration process, the adsorption capacity has been recovered. The synergistic effect of adsorption and ozonation benefit for the efficient dye removal from wastewater and the adsorbent regeneration achieved in an environmentally friendly and cost effective way.

Abstract: The present disclosure relates to methods for producing water repellent textile substrates and products thereof. The methods can be conducted without the use of perfluorocarbons.

Abstract: A method of manufacturing a via-in-via vertical interconnect in a printed circuit board (PCB), including: drilling a first hole through the PCB; drilling a second hole into a top side of the PCB; plating the first hole and the second hole with a conductive material to form an outer layer; drilling a third hole through the PCB wherein a portion of the plating is removed between the first hole and the second hole; filling the first, second, and third holes with an outer filler; drilling a fourth hole through the outer filler; plating the fourth hole with a conductive material to form an inner layer; filling the fourth hole with an inner filler; forming a via-in-via pad on top of the inner filler connected to the inner layer; and drilling a fifth hole through the bottom of the PCB along the fourth hole to remove a portion of the inner filler and inner layer wherein the top of the fifth hole is below the internal layer.

Abstract: Provided herein is a method of separating spandex from textile blends using biosolvents. The recovered material is of high purity while the chemical structure and molecular weight remain substantially unaffected by the treatment.

Abstract: A system and method for matching a plurality of components to a plurality of printed circuit board (PCB), including: characterizing the warpage characteristics of the plurality of components; characterizing the warpage characteristics of a site of the plurality of PCBs where the component will be placed; determining viable component and PCB pairings based upon the component warpage characteristics and the PCB warpage characteristics; and assembling the pairs of components and PCBs.

Abstract: The present disclosure relates to methods for producing functional regenerated cellulose composite fibers and products thereof. The methods can be conducted with the use of recycled and/or virgin cellulose powder.

Abstract: A circuit assembly, including: an integrated circuit (IC) with a plurality of connection pads; a ball grid array (BGA) including a plurality of solder balls arranged in an array, where plurality of solder balls are configured to connect the plurality of connections pads to a plurality of connections pads on a PCB; and a BGA spacer configured to fit among the plurality of solder balls, wherein the BGA spacer has a width based upon a height and spacing of the plurality of solder balls and a height based upon a height and spacing of the plurality of solder balls and a minimum distance between the IC and the PCB to prevent shorting of adjacent solder balls.

Abstract: A printed circuit board (PCB) including: a first through hole; a first conductive pad on a surface of the PCB, wherein the first conductive pad has a first surface treatment; a reflowed solder layer on the first surface treatment; and a first clinch nut pressed into the first through hole, wherein the first clinch nut is pressed into contact with the solder layer to create electrical connectivity between the first clinch nut and the first conductive pad.

Abstract: A printed circuit board for mounting electrical components thereupon include: a first side; a second side opposite the first side; electrical connection points disposed on the surface of an exterior edge of the printed circuit board; and wherein the exterior edge of the printed circuit board is between the first side and the second side. Further a method of manufacturing a printed circuit board for mounting electrical components thereupon includes the steps of disposing interconnect structures within the printed circuit board adjacent to at least one edge of the printed circuit board; and removing material from the printed circuit board edge to expose the interconnect structures such that the exposed interconnect structures correspond to a component connection footprint.

Abstract: Provided herein is a method of separating spandex from textile blends using biosolvents. The recovered material is of high purity while the chemical structure and molecular weight remain substantially unaffected by the treatment.

Abstract: Provided herein are amine-functionalized cellulose polymers useful for carbon dioxide capture and methods of preparation and use thereof.

Abstract: A printed circuit board structure is disclosed for providing reliable solderability for higher density component placement. The printed circuit board structure includes conductive points disposed on the surface of a printed circuit board which are separated by a channel disposed in the surface of the printed circuit board between the conductive points. The conductive points may be surface mount component terminal pads. The printed circuit board structure is particularly useful for overcoming component density limitations related to extremely miniaturized surface mount components known in the art.

Abstract: The present disclosure relates to methods for producing functional regenerated cellulose composite fibers and products thereof. The methods can be conducted with the use of recycled and/or virgin cellulose powder.