Patents by Inventor Alex Chi-Hong CHAN

Alex Chi-Hong CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220201754
    Abstract: An electronic device, a transmission system, and a transmission method are provided. The electronic device includes a capturing module, a processing module, and a transmission module. The capturing module is configured to receive a first set of signals. The processing module is configured to select a second set of signals from the first set of signals based on a condition. The transmission module is configured to transmit the second set of signals.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 23, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ting-Han CHEN, Yu-Chuang HSU, Alex Chi-Hong CHAN
  • Patent number: 11239178
    Abstract: A semiconductor package structure includes a substrate structure having a first surface and a second surface opposite to the first surface; at least two electronic components electrically connected to the first surface of the substrate structure; at least one shielding pad disposed on the first surface of the substrate structure; a plurality of vias connected to the at least one shielding pad; a plurality of shielding wirebonds disposed between the electronic components. Each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and the vias being free from overlapping with any of the plurality of vias.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: February 1, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chanyuan Liu, Han-Chee Yen, Kuo-Hsien Liao, Alex Chi-Hong Chan, Christophe Zinck
  • Patent number: 10910329
    Abstract: The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate, a waveguide component, a package body, a first dielectric layer, an antenna pattern, and an antenna feeding layer. The waveguide component is on the substrate. The package body is on the substrate and encapsulates the waveguide component. The first dielectric layer is on the package body and has a first surface and a second surface adjacent to the package body and opposite to the first surface. The antenna pattern is on the first surface of the first dielectric layer. The antenna feeding layer is on the second surface of the first dielectric layer.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: February 2, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo-Hsien Liao, Alex Chi-Hong Chan
  • Publication number: 20200185581
    Abstract: An optical device package includes a substrate, a light emitting device, a light detecting device, one or more electronic chips, a clear encapsulation layer and a patterned reflective layer. The substrate has a surface. The light emitting device is disposed on the surface of the substrate, the light detecting device is disposed on the surface of the substrate, and the light emitting device and the light detecting device have a gap. The one or more electronic chips are at least partially embedded in the substrate, and electrically connected to the light emitting device and the light detecting device. The clear encapsulation layer is disposed on the surface of the substrate and encapsulates the light emitting device and the light detecting device. The patterned reflective layer is disposed on an upper surface of the clear encapsulation layer and at least overlaps the gap between the light emitting device and the light detecting device in a projection direction perpendicular to the surface of the substrate.
    Type: Application
    Filed: December 6, 2019
    Publication date: June 11, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chanyuan LIU, Kuo-Hsien LIAO, Alex Chi-Hong CHAN, Fuh-Yuh SHIH
  • Publication number: 20200176394
    Abstract: A semiconductor package structure includes a substrate structure having a first surface and a second surface opposite to the first surface; at least two electronic components electrically connected to the first surface of the substrate structure; at least one shielding pad disposed on the first surface of the substrate structure; a plurality of vias connected to the at least one shielding pad; a plurality of shielding wirebonds disposed between the electronic components. Each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and the vias being free from overlapping with any of the plurality of vias.
    Type: Application
    Filed: November 25, 2019
    Publication date: June 4, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chanyuan LIU, Han-Chee YEN, Kuo-Hsien LIAO, Alex Chi-Hong CHAN, Christophe Zinck
  • Publication number: 20180342470
    Abstract: The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate, a waveguide component, a package body, a first dielectric layer, an antenna pattern, and an antenna feeding layer. The waveguide component is on the substrate. The package body is on the substrate and encapsulates the waveguide component. The first dielectric layer is on the package body and has a first surface and a second surface adjacent to the package body and opposite to the first surface. The antenna pattern is on the first surface of the first dielectric layer. The antenna feeding layer is on the second surface of the first dielectric layer.
    Type: Application
    Filed: May 23, 2017
    Publication date: November 29, 2018
    Inventors: Kuo-Hsien LIAO, Alex Chi-Hong CHAN