Patents by Inventor Alex Chi Keung Chan
Alex Chi Keung Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10431567Abstract: The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes.Type: GrantFiled: November 3, 2010Date of Patent: October 1, 2019Assignee: CREE, INC.Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Victor Yue Kwong Lau
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Publication number: 20180301438Abstract: Surface-mount devices comprising a casing having opposed main surfaces, side surfaces, and end surfaces. A lead frame partially encased by the casing comprises; an electrically conductive LED chip carrier part carrying three LEDs, each LED having first and second terminals, the first terminal of each LED being electrically and thermally coupled to the chip carrying surface; and (2) three conductive connection parts separate from the chip carrier part, each connection part having a connection pad, the second terminal of each LED being electrically coupled to the connection pad of a corresponding one of the connection parts. The LEDs extend linearly in a first direction, and each carrier part and connection part has a lead. The leads are disposed in parallel relationship with each other and extend through the end surfaces of the casing in a second direction, the second direction being orthogonal to the first direction.Type: ApplicationFiled: June 19, 2018Publication date: October 18, 2018Inventors: Alex Chi Keung Chan, Xuan WANG
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Patent number: 9831393Abstract: The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.Type: GrantFiled: July 27, 2011Date of Patent: November 28, 2017Assignee: CREE HONG KONG LIMITEDInventors: Alex Chi Keung Chan, Charles Chak Hau Pang
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Patent number: 9722158Abstract: A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, and increasing rigidity of the package assembly. In one embodiment, the package comprises a casing with a cavity extending into the interior of the casing from a first main surface. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of LEDs. Electrically conductive parts, separate from the parts carrying the LEDs, have a connection pad, wherein the LEDs are electrically coupled to the connection pad, such as by a wire bond. This arrangement allows for a respective electrical signal to be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.Type: GrantFiled: October 15, 2012Date of Patent: August 1, 2017Assignee: CREE HUIZHOU SOLID STATE LIGHTING COMPANY LIMITEDInventors: Alex Chi Keung Chan, Yue Kwong Victor Lau, Xuan Wang, David Todd Emerson
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Patent number: 9240395Abstract: The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.Type: GrantFiled: November 30, 2010Date of Patent: January 19, 2016Assignee: CREE HUIZHOU OPTO LIMITEDInventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Li Fei Hong
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Patent number: 8901583Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.Type: GrantFiled: April 12, 2010Date of Patent: December 2, 2014Assignee: Cree Huizhou Opto LimitedInventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
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Patent number: 8748915Abstract: The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis.Type: GrantFiled: August 25, 2010Date of Patent: June 10, 2014Assignees: Cree Hong Kong Limited, Cree, Inc.Inventors: Alex Chi Keung Chan, David Todd Emerson
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Publication number: 20120132937Abstract: The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.Type: ApplicationFiled: November 30, 2010Publication date: May 31, 2012Inventors: ALEX CHI KEUNG CHAN, Charles Chak Hau Pang, Li Fei Hong
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Publication number: 20120104426Abstract: The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes.Type: ApplicationFiled: November 3, 2010Publication date: May 3, 2012Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Victor Yue Kwong Lau
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Publication number: 20120025227Abstract: The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.Type: ApplicationFiled: July 27, 2011Publication date: February 2, 2012Inventors: ALEX CHI KEUNG CHAN, Charles Chak Hau Pang
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Publication number: 20110248293Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.Type: ApplicationFiled: April 12, 2010Publication date: October 13, 2011Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
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Publication number: 20110042698Abstract: The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis.Type: ApplicationFiled: August 25, 2010Publication date: February 24, 2011Inventors: Alex Chi Keung Chan, David Todd Emerson
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Publication number: 20110037083Abstract: LED packages and LED displays utilizing the LED packages are disclosed, with the LED packages arranged to provide good contrast between the different pixels in an LED display while not reducing the perceived luminous flux or brightness of the display. One embodiment of an LED package comprises an LED chip and conversion material arranged to convert at least some light emitted from the LED chip. The package emits light from the conversion material or a combination of light from the conversion material and the LED chip. A reflective area is included around the LED chip that substantially reflects the package light and a contrasting area is included outside the reflective area and has a color that contrasts with the package light. LED displays according to the present invention comprise a plurality of LED packages arranged in relation to one another to produce messages or images, with the package providing improved pixel contrast.Type: ApplicationFiled: September 3, 2010Publication date: February 17, 2011Inventors: ALEX CHI KEUNG CHAN, DAVID EMERSON, CHAK HAU PANG, JUN ZHANG
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Publication number: 20090072251Abstract: In one embodiment, a surface-mount device comprises a casing having opposed, first and second main surfaces, side surfaces, and end surfaces. A lead frame partially encased by the casing comprises (1) an electrically conductive LED chip carrier part having a surface carrying a linear array of three LEDs adapted to be energized to produce in combination a substantially full range of colors, each LED having a first electrical terminal and a second electrical terminal, the first terminal of each of the three LEDs being electrically and thermally coupled to the chip carrying surface of the chip carrier part; and (2) three electrically conductive connection parts separate from the chip carrier part, each of the three connection parts having a connection pad, the second terminal of each of the three LEDs being electrically coupled to the connection pad of a corresponding one of the three connection parts with a single wire bond.Type: ApplicationFiled: December 14, 2007Publication date: March 19, 2009Inventors: Alex Chi Keung Chan, Xuan Wang