Abstract: One example described herein includes a method for fabricating integrated circuit (IC) packages. The method includes fabricating a plurality of IC dies and providing a conductive metal material sheet. The method also includes laser-cutting the conductive metal material sheet to form a lead-frame sheet. The lead-frame sheet includes at least one of through-holes and three-dimensional locking features. The method further includes coupling the IC dies to the lead-frame sheet and coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages.

Abstract: An integrated circuit package includes a first die attach pad (DAP) having a first bottom surface, a first semiconductor die attached to the first DAP, a second DAP having a second bottom surface, wherein the first bottom surface and the second bottom surface are coplanar, and a second semiconductor die attached to the second DAP. A nonlinear DAP linking structure couples the first DAP to the second DAP, wherein the DAP linking structure does not include any direct linear connections between the first DAP and the second DAP. The nonlinear DAP linking structure is configured to deform without causing the first DAP and the second DAP to become non-coplanar. A mold compound covers the first and second DAPs, the first and second semiconductor dies, and the nonlinear DAP linking structure.

Abstract: One example described herein includes a method for fabricating integrated circuit (IC) packages. The method includes fabricating a plurality of IC dies and providing a conductive metal material sheet. The method also includes laser-cutting the conductive metal material sheet to form a lead-frame sheet. The lead-frame sheet includes at least one of through-holes and three-dimensional locking features. The method further includes coupling the IC dies to the lead-frame sheet and coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages.

Abstract: A system and process to determine the causal relationship between advertisement delivery data and sales data are disclosed. According to one embodiment, a method comprises importing advertisement data and sales data. The advertisement data and the sales data are joined to generate a joined data set. Customer journeys are generated for a timeframe from the joined data set. A first group of customers who saw an advertisement of interest are identified. A second group of customers who did not see the advertisement of interest are identified. Each customer of the first group is matched to a customer in the second group who is similar to the customer of the first group. An average treatment effect for the advertisement of interest is calculated.

Abstract: A location based Quality of Service (QoS) is negotiated for each mobile terminal entering a mobile network. Each mobile terminal receives a routing area identification that identifies the mobile terminal's location. The routing area identification and International Mobile Subscriber Identity (IMSI) are transmitted to a QoS selection block within a QoS network element to map the mobile terminal to a QoS group and a corresponding QoS profile. The QoS selection block provides a selected QoS based on the QoS profile to the network element wherein the selected QoS rating is negotiated with the mobile terminal. The QoS negotiation includes using the selected QoS rating when the mobile terminal routing area maps to one of the corresponding QoS groups or using a subscribed QoS rating received from the roaming mobile terminal HLR when the mobile terminal routing area and IMSI do not map to one of the corresponding QoS groups.