Abstract: A method of processing a semiconductor wafer includes depositing a silicon layer on the semiconductor wafer. A first slurry is applied to the semiconductor wafer and the silicon layer is polished to smooth the silicon layer. A second slurry is applied to the semiconductor wafer. The second slurry includes a greater amount of a caustic agent than the first slurry.

Abstract: Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.

Abstract: A method of processing a semiconductor wafer includes depositing a silicon layer on the semiconductor wafer. A first slurry is applied to the semiconductor wafer and the silicon layer is polished to smooth the silicon layer. A second slurry is applied to the semiconductor wafer. The second slurry includes a greater amount of a caustic agent than the first slurry.

Abstract: Methods for polishing semiconductor substrates are disclosed. The finish polishing sequence is adjusted based on a measured edge roll-off of an analyzed substrate.

Abstract: Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.

Abstract: This disclosure describes a biotechnological method for producing rebaudioside M (Reb M), using recombinantly produced glucosyltransferases, which can be carried out in a single reaction vessel using two glucosyltransferases and a uridine diphosphate glucose (UDPG) regenerating system. The method can be used to produce the commercially desirable Reb M from rubusoside, stevioside, or rebaudioside A (Reb A), which are all naturally more abundant steviol glycosides but with commercially less desirable properties.

Abstract: A method of processing a semiconductor wafer includes depositing a silicon layer on the semiconductor wafer. A first slurry is applied to the semiconductor wafer and the silicon layer is polished to smooth the silicon layer. A second slurry is applied to the semiconductor wafer. The second slurry includes a greater amount of a caustic agent than the first slurry.

Abstract: Methods for polishing semiconductor substrates are disclosed. The finish polishing sequence is adjusted based on a measured edge roll-off of an analyzed substrate.

Abstract: A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive.

Abstract: A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive.

Abstract: A polishing head assembly for single side polishing of silicon wafers includes a polishing head and a cap. The polishing head includes a top surface and a bottom surface and defines a longitudinal axis extending therethrough. The cap is positioned coaxially with the polishing head and includes an upper surface and a lower surface. The upper surface is spaced from the bottom surface of the polishing head to form a chamber that allows the cap to deflect toward the polishing head.

Abstract: A vaporized fuel injection system for a combustion engine that includes a fuel vaporization chamber and a two-way valve. The fuel vaporization chamber has a chamber input and a chamber output, and is connected with a fuel source via the chamber input. The fuel vaporization chamber is for vaporizing fuel input to the chamber input and outputting vaporized fuel to the chamber output. The two-way valve has first and second valve inputs and an valve output. The first valve input is connected to the chamber output, and the second valve input is connected to the fuel source. The two-way valve is switchable to allow fuel to flow from only one of the first or second valve inputs to the valve output.

Abstract: A vaporized fuel injection system for a combustion engine that includes a fuel vaporization chamber and a two-way valve. The fuel vaporization chamber has a chamber input and a chamber output, and is connected with a fuel source via the chamber input. The fuel vaporization chamber is for vaporizing fuel input to the chamber input and outputting vaporized fuel to the chamber output. The two-way valve has first and second valve inputs and an valve output. The first valve input is connected to the chamber output, and the second valve input is connected to the fuel source. The two-way valve is switchable to allow fuel to flow from only one of the first or second valve inputs to the valve output.

Abstract: The compounds of formula (I) are substituted glycine derivatives useful in the treatment of epilepsy, faintness attacks, hypokinesia, cranial disorders, neurodegenerative disorders, depression, anxiety, panic, pain, arthritis, neuropathological disorders, sleep disorders, visceral pain disorders and gastrointestinal disorders. Processes for the preparation of the final products and intermediates useful in the process are included. Pharmaceutical compositions containing one or more of the compounds are also included.

Abstract: A computing platform rents a computing environment to execute a process supplied from a user device. Integrity of the computing platform is verified using a trusted device which obtains an integrity metric particularly of the host operating system during start up. The computing environment is confirmed as being suitable for the requirements of the process, and then verified ideally again using an integrity metric of the computing environment produced by the trusted device. The user process is then supplied from the user device to the computing environment.

Abstract: An e-mail handling system stores e-mails 30 in separate compartments 241, 242. Highest risk e-mails are stored in individual compartments 242, while lower risk e-mails are stored together in one compartment 241 grouped according to any suitable characteristic such as the recipient or sender. An e-mail agent 27 examines each incoming e-mail according to a security policy. Stored e-mails are accessed by a combination of first and second browsers. The first browser 28 has cross compartment access to navigate the stored e-mails 30, while the second browser 29 is provided in the same compartment as a particular stored e-mail with access only to read within that compartment, 241, 242.

Abstract: A method for treating a fungal infection is disclosed. The method includes contacting a fungus with a substituted aurone derivative.

Abstract: A method for treating a fungal infection is disclosed.