Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.

Abstract: In order to avoid undesired access to a data packet in a distributed computer system (10, 13), a class that indicates the degree of freedom of access is allocated to the data packet within the framework of an access control list (ACL). The data packet (10, 13) is additionally allocated to specific privileges that a data processing device (30) must satisfy in order to obtain access to the data packet (10, 13). These privileges can be deposited at the data processing device (31, 41) that has the data packet (10, 13) available to it. A request of a data packet (10, 13) can ensue in a protected fashion within the framework of a security procedure.