Patents by Inventor Alex Gritti
Alex Gritti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11945714Abstract: An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.Type: GrantFiled: July 30, 2021Date of Patent: April 2, 2024Assignee: STMICROELECTRONICS S.r.l.Inventors: Alex Gritti, Marco Del Sarto
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Publication number: 20230171911Abstract: The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.Type: ApplicationFiled: November 16, 2022Publication date: June 1, 2023Applicant: STMICROELECTRONICS S.r.l.Inventors: Luca MAGGI, Marco DEL SARTO, Alex GRITTI, Amedeo MAIERNA
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Publication number: 20220238485Abstract: A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region capacitively coupled to a first portion of the buried conductive region. A second die is fixed to the support and carries, on a first main surface, a second die contact region capacitively coupled to a second portion of the buried conductive region. A packaging mass encloses the first die, the second die, the first die contact region, the second die contact region, and, at least partially, the support.Type: ApplicationFiled: January 20, 2022Publication date: July 28, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Dario PACI, Silvia ADORNO, Marco DEL SARTO, Fabrizio CERINI, Alex GRITTI
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Patent number: 11309237Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.Type: GrantFiled: September 27, 2019Date of Patent: April 19, 2022Assignees: STMICROELECTRONICS S.r.l., STMICROELECTRONICS (MALTA) LTDInventors: Marco Del Sarto, Alex Gritti, Pierpaolo Recanatini, Michael Borg
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Publication number: 20220099957Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.Type: ApplicationFiled: September 21, 2021Publication date: March 31, 2022Applicant: STMicroelectronics S.r.l.Inventors: Marco DEL SARTO, Alex GRITTI, Amedeo MAIERNA, Luca MAGGI
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Publication number: 20220033251Abstract: An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.Type: ApplicationFiled: July 30, 2021Publication date: February 3, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Alex Gritti, Marco Del Sarto
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Publication number: 20210098355Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.Type: ApplicationFiled: September 27, 2019Publication date: April 1, 2021Inventors: Marco DEL SARTO, Alex GRITTI, Pierpaolo RECANATINI, Michael BORG
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Patent number: 10605684Abstract: A transducer modulus, comprising: a supporting substrate; a cap, which is arranged on the supporting substrate and defines a chamber therewith; a pressure transducer in the chamber; an acoustic transducer in the chamber; and a processing chip, or ASIC, operatively coupled to the pressure transducer and to the acoustic transducer. The pressure transducer and the acoustic transducer are arranged on top of one another to form a stack.Type: GrantFiled: May 25, 2017Date of Patent: March 31, 2020Assignee: STMICROELECTRONICS S.R.L.Inventors: Alex Gritti, Marco Omar Ghidoni
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Patent number: 10225635Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.Type: GrantFiled: April 29, 2016Date of Patent: March 5, 2019Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Roberto Brioschi, Alex Gritti, Kevin Formosa, Paul Anthony Barbara
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Publication number: 20180149538Abstract: A transducer modulus, comprising: a supporting substrate; a cap, which is arranged on the supporting substrate and defines a chamber therewith; a pressure transducer in the chamber; an acoustic transducer in the chamber; and a processing chip, or ASIC, operatively coupled to the pressure transducer and to the acoustic transducer. The pressure transducer and the acoustic transducer are arranged on top of one another to form a stack.Type: ApplicationFiled: May 25, 2017Publication date: May 31, 2018Inventors: Alex GRITTI, Marco Omar GHIDONI
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Patent number: 9822001Abstract: A process for manufacturing a packaged microelectromechanical device includes: forming a lid having a face and a cavity open on the face; coating the face of the lid and walls of the cavity with a metal layer containing copper; and coating the metal layer with a protective layer.Type: GrantFiled: October 30, 2013Date of Patent: November 21, 2017Assignee: STMicroelectronics S.r.l.Inventors: Alex Gritti, Paolo Crema
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Publication number: 20170006368Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.Type: ApplicationFiled: April 29, 2016Publication date: January 5, 2017Inventors: Roberto BRIOSCHI, Alex GRITTI, Kevin FORMOSA, Paul Anthony BARBARA
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Patent number: 9428380Abstract: One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.Type: GrantFiled: April 14, 2015Date of Patent: August 30, 2016Assignee: STMicroelectronics S.r.l.Inventors: Fulvio Vittorio Fontana, Giovanni Graziosi, Alex Gritti
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Publication number: 20150217993Abstract: One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.Type: ApplicationFiled: April 14, 2015Publication date: August 6, 2015Inventors: Fulvio Vittorio Fontana, Giovanni Graziosi, Alex Gritti
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Patent number: 9060227Abstract: One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.Type: GrantFiled: October 24, 2012Date of Patent: June 16, 2015Assignee: STMicroelectronics S.r.l.Inventors: Fulvio Vittorio Fontana, Giovanni Graziosi, Alex Gritti
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Patent number: 8837754Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.Type: GrantFiled: February 22, 2012Date of Patent: September 16, 2014Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Kevin Formosa, Mark Anthony Azzopardi, Mario Francesco Cortese, Mark Shaw, Alex Gritti, Luca Maggi, Filippo David
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Publication number: 20140131819Abstract: A process for manufacturing a packaged microelectromechanical device includes: forming a lid having a face and a cavity open on the face; coating the face of the lid and walls of the cavity with a metal layer containing copper; and coating the metal layer with a protective layer.Type: ApplicationFiled: October 30, 2013Publication date: May 15, 2014Applicant: STMicroelectronics S.r.l.Inventors: Alex Gritti, Paolo Crema
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Publication number: 20120153771Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.Type: ApplicationFiled: February 22, 2012Publication date: June 21, 2012Applicants: STMICROELECTRONICS (MALTA) LTD., STMICROELECTRONICS S.R.L.Inventors: Kevin Formosa, Mark Anthony Azzopardi, Mario Francesco Cortese, Mark Shaw, Alex Gritti, Luca Maggi, Filippo David
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Patent number: 7605476Abstract: A stacked die semiconductor package includes: a substrate, having a first surface and an opposite surface thereto; a plurality of dice, structured for being stacked one on top of the other on the first surface of the substrate, including at least a first die which is mounted closest to the first surface, a second die mounted thereupon and having a larger footprint area than the first die, and a top die having a smaller footprint area than the underlying die thereof, and each having a plurality of contact pads and a plurality of wires for electrically connecting the dice to the first surface of the substrate; at least one interposer between the plurality of dice; advantageously, said top die is electrically directly connected to one of the underlying dice. A method for the assembly of a stacked die semiconductor package is provided.Type: GrantFiled: September 27, 2006Date of Patent: October 20, 2009Assignee: STMicroelectronics S.r.l.Inventor: Alex Gritti
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Publication number: 20070069391Abstract: A stacked die semiconductor package includes: a substrate, having a first surface and an opposite surface thereto; a plurality of dice, structured for being stacked one on top of the other on the first surface of the substrate, including at least a first die which is mounted closest to the first surface, a second die mounted thereupon and having a larger footprint area than the first die, and a top die having a smaller footprint area than the underlying die thereof, and each having a plurality of contact pads and a plurality of wires for electrically connecting the dice to the first surface of the substrate; at least one interposer between the plurality of dice; advantageously, said top die is electrically directly connected to one of the underlying dice. A method for the assembly of a stacked die semiconductor package is provided.Type: ApplicationFiled: September 27, 2006Publication date: March 29, 2007Applicant: STMicroelectronics S.r.I.Inventor: Alex Gritti