Abstract: The present invention provides an ocean compostable thermoplastic material that may be used in final consumer products, for example, plastic packaging, shrink wrap, and food storage bags.

Abstract: Various embodiments relate to a voltage converter including a control unit configured for operating in a hysteretic control mode. A control unit may be configured to receive a PWM signal, a duty cycle signal, at least one reference voltage, a factor of an output voltage of the voltage converter, and a factor of an input voltage of the voltage converter. The control unit may also be configured to compare the at least one reference voltage to the factor of the output voltage and the factor of the input voltage. Further, the control unit may be configured to generate a first control signal mirroring the PWM signal in response to at least one of: the factor of the input voltage being greater than the at least one reference voltage and the factor of the output voltage being greater than the at least one reference voltage.

Abstract: Various embodiments relate to a voltage converter including a control unit configured for operating in a hysteretic control mode. A control unit may be configured to receive a PWM signal, a duty cycle signal, at least one reference voltage, a factor of an output voltage of the voltage converter, and a factor of an input voltage of the voltage converter. The control unit may also be configured to compare the at least one reference voltage to the factor of the output voltage and the factor of the input voltage. Further, the control unit may be configured to generate a first control signal mirroring the PWM signal in response to at least one of: the factor of the input voltage being greater than the at least one reference voltage and the factor of the output voltage being greater than the at least one reference voltage.

Abstract: A biological liquid collection vessel is adapted to contain a biological liquid to be centrifuged. The collection vessel has a vessel body having an open upper end and a closed lower end, a continuous wall, a target area at the upper end, and a solids area at the lower end that is connected to the target area. The target area is extended in length. In some embodiments, a volume capacity of both of the target area and the solids area are configured so that a red blood cell portion of the centrifuged biological liquid (e.g., blood) is substantially contained in the solids area, and the serum or plasma portion of the centrifuged biological liquid is substantially contained in the target area. Methods of and systems using the liquid collection vessels are provided, as are other aspects.

Abstract: A switch mode power supply (voltage converter) is adapted as a current-mode control buck regulator for different loading conditions. The voltage converter operates in a continuous conduction mode (CCM) during heavy load conditions using pulse width modulation (PWM). When a zero-current detector determines no inductor current during light load conditions (discontinuous conduction mode (DCM) region), the controller initiates adaptive duty control using pulse frequency modulation (PFM). Adaptive duty estimation circuitry provides controllable energy to charge the power inductor to maintain voltage accuracy and maximize efficiency when in the PFM mode. Using clock synchronization and a single control-loop, smooth transition between PFM, PWM, and bypass modes is automatically performed. Clock synchronization from a master oscillator provides a base for frequency division in different operation modes which gives controllable evenly distributed switching harmonics.

Abstract: A switch mode power supply (voltage converter) is adapted as a current-mode control buck regulator for different loading conditions. The voltage converter operates in a continuous conduction mode (CCM) during heavy load conditions using pulse width modulation (PWM). When a zero-current detector determines no inductor current during light load conditions (discontinuous conduction mode (DCM) region), the controller initiates adaptive duty control using pulse frequency modulation (PFM). Adaptive duty estimation circuitry provides controllable energy to charge the power inductor to maintain voltage accuracy and maximize efficiency when in the PFM mode. Using clock synchronization and a single control-loop, smooth transition between PFM, PWM, and bypass modes is automatically performed. Clock synchronization from a master oscillator provides a base for frequency division in different operation modes which gives controllable evenly distributed switching harmonics.

Abstract: Methods and systems of the present disclosure provide techniques for dynamically assessing a permission of a user that one of modifies or adds at least one content change in a source environment. The methods may further assess the permission of the user when the at least one content change relates to role content data or functional content data. The permissions of the users may be evaluated based on rule data specific to the source environment or user assignment data relating to the source environment. In addition, the disclosure provides techniques for reporting the dynamic assessment to an administrator based on a triggering event.

Abstract: Methods and systems of the present disclosure provide techniques for dynamically assessing a permission of a user that one of modifies or adds at least one content change in a source environment. The methods may further assess the permission of the user when the at least one content change relates to role content data or functional content data. The permissions of the users may be evaluated based on rule data specific to the source environment or user assignment data relating to the source environment. In addition, the disclosure provides techniques for reporting the dynamic assessment to an administrator based on a triggering event.

Abstract: Disclosed are exemplary embodiments of a flame retardant, electrically conductive adhesive material. In an exemplary embodiment, a flame retardant, electrically conductive adhesive material suitable for use as tape generally includes a layer of adhesive. A layer of electrically conductive fabric is on the layer of adhesive. A flame retardant coating is on the layer of electrically conductive fabric. The flame retardant coating includes a carbon-containing resin.

Abstract: Disclosed are exemplary embodiments of a flame retardant, electrically conductive adhesive material. In an exemplary embodiment, a flame retardant, electrically conductive adhesive material suitable for use as tape generally includes a layer of adhesive. A layer of electrically conductive fabric is on the layer of adhesive. A flame retardant coating is on the layer of electrically conductive fabric. The flame retardant coating includes a carbon-containing resin.

Abstract: A biological liquid collection vessel is adapted to contain a biological liquid to be centrifuged. The collection vessel has a vessel body having an open upper end and a closed lower end, a continuous wall, a target area at the upper end, and a solids area at the lower end that is connected to the target area. The target area is extended in length. In some embodiments, a volume capacity of both of the target area and the solids area are configured so that a red blood cell portion of the centrifuged biological liquid (e.g., blood) is substantially contained in the solids area, and the serum or plasma portion of the centrifuged biological liquid is substantially contained in the target area. Methods of and systems using the liquid collection vessels are provided, as are other aspects.

Abstract: Systems and methods for defining and executing platform and language independent audit templates are disclosed. Each audit template can include a number of audit task templates. The audit task templates include general instructions for performing an audit task. Each audit task template can be instantiated as an audit task in an associated audit operation that includes organization or process specific information. Each audit task template and audit task can be linked with one or more business rules. Such business rules include translation logic for translating requirements of each audit task into a format expected by specific program, located in a central management system, invoked to operate on the required target business data. The business rules can also include translation data for interpreting the results returned from such programs. The audits operation or business rules can also include deficiency criteria, or alert conditions for initiating audit issues and remediation workflows.

Abstract: The present disclosure provides an image sensor semiconductor device. A semiconductor substrate having a first-type conductivity is provided. A plurality of sensor elements is formed in the semiconductor substrate. An isolation feature is formed between the plurality of sensor elements. An ion implantation process is performed to form a doped region having the first-type conductivity substantially underlying the isolation feature using at least two different implant energy.

Abstract: Provided is a method for fabricating an image sensor device that includes providing a substrate having a front side and a back side; patterning a photoresist on the front side of the substrate to define an opening having a first width, the photoresist having a first thickness correlated to the first width; performing an implantation process through the opening using an implantation energy correlated to the first thickness thereby forming a first doped isolation feature; forming a light sensing feature adjacent to the first doped isolation feature, the light sensing feature having a second width; and thinning the substrate from the back side so that the substrate has a second thickness that does not exceed twice a depth of the first doped isolation feature. A pixel size is substantially equal to the first and second widths.

Abstract: Provided is a method of fabricating a semiconductor device. The method includes providing a device substrate having a front side and a back side, the device substrate having a first refractive index, forming an embedded target over the front side of the device substrate, forming a reflective layer over the embedded target, forming a media layer over the back side of the device substrate, the media layer having a second refractive index less than the first refractive index, and projecting radiation through the media layer and the device substrate from the back side so that the embedded target is detected for a semiconductor process.

Abstract: Provided is a method of fabricating a semiconductor device. The method includes providing a device substrate having a front side, a back side, and a first edge portion, forming a material layer over a portion of the front side of the device substrate, trimming the first edge portion, removing the material layer, bonding the front side of the device substrate to a carrier substrate, thinning the device substrate from the back side, and trimming a second edge portion of the thinned device substrate.

Abstract: Provided is a method for fabricating an image sensor device that includes providing a substrate having a front side and a back side; patterning a photoresist on the front side of the substrate to define an opening having a first width, the photoresist having a first thickness correlated to the first width; performing an implantation process through the opening using an implantation energy correlated to the first thickness thereby forming a first doped isolation feature; forming a light sensing feature adjacent to the first doped isolation feature, the light sensing feature having a second width; and thinning the substrate from the back side so that the substrate has a second thickness that does not exceed twice a depth of the first doped isolation feature. A pixel size is substantially equal to the first and second widths.

Abstract: Provided is a method for fabricating an image sensor device that includes providing a substrate having a front side and a back side; patterning a photoresist on the front side of the substrate to define an opening having a first width, the photoresist having a first thickness correlated to the first width; performing an implantation process through the opening using an implantation energy correlated to the first thickness thereby forming a first doped isolation feature; forming a light sensing feature adjacent to the first doped isolation feature, the light sensing feature having a second width; and thinning the substrate from the back side so that the substrate has a second thickness that does not exceed twice a depth of the first doped isolation feature. A pixel size is substantially equal to the first and second widths.

Abstract: Provided is a method for fabricating an image sensor device that includes providing a substrate having a front side and a back side; patterning a photoresist on the front side of the substrate to define an opening having a first width, the photoresist having a first thickness correlated to the first width; performing an implantation process through the opening using an implantation energy correlated to the first thickness thereby forming a first doped isolation feature; forming a light sensing feature adjacent to the first doped isolation feature, the light sensing feature having a second width; and thinning the substrate from the back side so that the substrate has a second thickness that does not exceed twice a depth of the first doped isolation feature. A pixel size is substantially equal to the first and second widths.