Patents by Inventor Alex M. H. WONG

Alex M. H. WONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12132253
    Abstract: A metasurface includes a dielectric material, a ground plane on a back side of the dielectric material; and at least one conductive element on a top surface of the dielectric material, wherein the at least one conductive element includes at least one of a ground-backed dipole or a slot array.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: October 29, 2024
    Assignee: Hitachi Rail GTS Canada Inc.
    Inventors: Alon Ion Green, Peter Timmermans, Walter Kinio, Alex M. H. Wong, Philip Christian, George V. Eleftheriades
  • Publication number: 20220037796
    Abstract: A metasurface includes a dielectric material, a ground plane on a back side of the dielectric material; and at least one conductive element on a top surface of the dielectric material, wherein the at least one conductive element includes at least one of a ground-backed dipole or a slot array.
    Type: Application
    Filed: October 19, 2021
    Publication date: February 3, 2022
    Inventors: Alon Ion GREEN, Peter TIMMERMANS, Walter KINIO, Alex M. H. WONG, Philip CHRISTIAN, George V. ELEFTHERIADES
  • Patent number: 11183769
    Abstract: A metasurface includes a dielectric material, a ground plane on a back side of the dielectric material; and at least one conductive element on a top surface of the dielectric material, wherein the at least one conductive element includes at least one of a ground-backed dipole or a slot array.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: November 23, 2021
    Assignee: THALES CANADA INC.
    Inventors: Alon Green, Peter Timmermans, Walter Kinio, Alex M. H. Wong, Philip Christian, George V. Eleftheriades
  • Publication number: 20200028272
    Abstract: A metasurface includes a dielectric material, a ground plane on a back side of the dielectric material; and at least one conductive element on a top surface of the dielectric material, wherein the at least one conductive element includes at least one of a ground-backed dipole or a slot array.
    Type: Application
    Filed: October 26, 2018
    Publication date: January 23, 2020
    Inventors: Alon GREEN, Peter TIMMERMANS, Walter KINIO, Alex M. H. WONG, Philip CHRISTIAN, George V. ELEFTHERIADES