Abstract: A personal training system assisted by artificial intelligence (AI) has a personal training device and a control device. The personal training device includes a jacket and pants, and houses sensors at positions corresponding to a user's main muscle groups for monitoring the user's movement posture and muscle activity of the main muscle groups. The control device has a data preprocessing unit for processing detected-signal data of the sensors, a training analysis device for executing an AI algorithm to conduct fatigue analysis of the user's movement based on the user profile and the detected-signal data, and to make training load recommendations. The personal training system can simultaneously monitor posture, muscle activity and muscle fatigue in real time during the exercise; and use the AI algorithm to evaluate exercise performance and provide real-time feedbacks to improve the exercise and training efficiency, and reduce the risk of injury.

Abstract: A texture analyzer having a support structure including a base plate, a carriage support, and a moveable carriage that receives a load cell module; a fixture to receive a sample between the base plate and the load cell module; a memory storing support structure and load cell module deflection parameters; and a processor. The processor is configured to identify the load cell module, retrieve the support structure deflection parameters and one of multiple load cell module deflection parameters, obtain raw measurement signals from the load cell module, and refine the raw measurement signals to compensate for deflection in the load cell module using the retrieved load cell module deflection parameters and support structure deflection parameters.

Abstract: A texture analyzer having a support structure including a base plate, a carriage support, and a moveable carriage that receives a load cell module; a fixture to receive a sample between the base plate and the load cell module; a memory storing support structure and load cell module deflection parameters; and a processor. The processor is configured to identify the load cell module, retrieve the support structure deflection parameters and one of multiple load cell module deflection parameters, obtain raw measurement signals from the load cell module, and refine the raw measurement signals to compensate for deflection in the load cell module using the retrieved load cell module deflection parameters and support structure deflection parameters.

Abstract: Viscosity or rheology measuring instrument utilizing Hall Effect or like magnetic coupling with parts mounted on driving and driven rotational assemblies.

Abstract: A non-volatile storage system is disclosed that includes non-volatile memory cells designed for high endurance and lower retention than other non-volatile memory cells.

Abstract: An erase operation for a 3D stacked memory device assigns storage elements to groups according to an expected erase speed. The storage elements are then erased according to their group to provide a more uniform erase depth and a tighter erase distribution. In one approach, the control gate voltages are set differently for the different groups to slow down the storage elements which are expected to have a faster programming speed. An erase or inhibit status can be set for all groups together. In another approach, the control gate voltages are common for the different groups but an erase or inhibit status is set for each group separately.

Abstract: An erase process for a 3D stacked memory device allows a portion of a block of memory cells to be erased. In one approach, in a U-shaped NAND string configuration, memory cells in the drain- or source-side columns are erased. In another approach, such as in a U-shaped or a straight NAND string configuration, memory cells in a portion of a column of memory cells are erased, and a dummy memory cell is provided between the erased and non-erased memory cells. A dummy memory cell can be on either side (e.g., above and below) of an erase memory cell, or on either side of a non-erased memory cell. A dummy memory cell is ineligible to store user data, but prevents a downshift in the threshold voltage of an erased memory cell from changing the threshold voltage of a non-erased memory cell, due to capacitive coupling.

Abstract: When data from a portion of a three dimensional NAND memory array is determined to be uncorrectable by Error Correction Code (ECC), a determination is made as to whether data is uncorrectable by ECC throughout some unit that is larger than the portion. If modified read conditions provide ECC correctable data, the modified read conditions are recorded for subsequent reads of the larger unit.

Abstract: Portions of data stored in a three dimensional memory array are selected based on their locations for calculation of redundancy data. Locations are selected so that no two portions in a set of portions for a given calculation are likely to become uncorrectable at the same time. Selected portions may be separated by at least one word line and separated by at least one string in a block.

Abstract: An erase operation for a 3D stacked memory device assigned storage elements to groups according to an expected erase speed. The storage elements are then erased according to their group to provide a more uniform erase depth and a tighter erase distribution. In one approach, the control gate voltages are set differently for the different groups to slow down the storage elements which are expected to have a faster programming speed. An erase or inhibit status can be set for all groups together. In another approach, the control gate voltages are common for the different groups but an erase or inhibit status is set for each group separately.

Abstract: An erase process for a 3D stacked memory device allows a portion of a block of memory cells to be erased. In one approach, in a U-shaped NAND string configuration, memory cells in the drain- or source-side columns are erased. In another approach, such as in a U-shaped or a straight NAND string configuration, memory cells in a portion of a column of memory cells are erased, and a dummy memory cell is provided between the erased and non-erased memory cells. A dummy memory cell can be on either side (e.g., above and below) of an erase memory cell, or on either side of a non-erased memory cell. A dummy memory cell is ineligible to store user data, but prevents a downshift in the threshold voltage of an erased memory cell from changing the threshold voltage of a non-erased memory cell, due to capacitive coupling.

Abstract: An erase operation for a 3D stacked memory device assigns storage elements to groups according to an expected erase speed. The storage elements are then erased according to their group to provide a more uniform erase depth and a tighter erase distribution. In one approach, the control gate voltages are set differently for the different groups to slow down the storage elements which are expected to have a faster programming speed. An erase or inhibit status can be set for all groups together. In another approach, the control gate voltages are common for the different groups but an erase or inhibit status is set for each group separately.

Abstract: When data from a portion of a three dimensional NAND memory array is determined to be uncorrectable by Error Correction Code (ECC), a determination is made as to whether data is uncorrectable by ECC throughout some unit that is larger than the portion. If modified read conditions provide ECC correctable data, the modified read conditions are recorded for subsequent reads of the larger unit.

Abstract: Portions of data stored in a three dimensional memory array are selected based on their locations for calculation of redundancy data. Locations are selected so that no two portions in a set of portions for a given calculation are likely to become uncorrectable at the same time. Selected portions may be separated by at least one word line and separated by at least one string in a block.

Abstract: An erase process for a 3D stacked memory device allows a portion of a block of memory cells to be erased. In one approach, in a U-shaped NAND string configuration, memory cells in the drain- or source-side columns are erased. In another approach, such as in a U-shaped or a straight NAND string configuration, memory cells in a portion of a column of memory cells are erased, and a dummy memory cell is provided between the erased and non-erased memory cells. A dummy memory cell can be on either side (e.g., above and below) of an erase memory cell, or on either side of a non-erased memory cell. A dummy memory cell is ineligible to store user data, but prevents a downshift in the threshold voltage of an erased memory cell from changing the threshold voltage of a non-erased memory cell, due to capacitive coupling.

Abstract: An erase operation for a 3D stacked memory device assigned storage elements to groups according to an expected erase speed. The storage elements are then erased according to their group to provide a more uniform erase depth and a tighter erase distribution. In one approach, the control gate voltages are set differently for the different groups to slow down the storage elements which are expected to have a faster programming speed. An erase or inhibit status can be set for all groups together. In another approach, the control gate voltages are common for the different groups but an erase or inhibit status is set for each group separately.

Abstract: An erase operation for a 3D stacked memory device assigned storage elements to groups according to an expected erase speed. The storage elements are then erased according to their group to provide a more uniform erase depth and a tighter erase distribution. In one approach, the control gate voltages are set differently for the different groups to slow down the storage elements which are expected to have a faster programming speed. An erase or inhibit status can be set for all groups together. In another approach, the control gate voltages are common for the different groups but an erase or inhibit status is set for each group separately.

Abstract: An erase operation for a 3D stacked memory device assigned storage elements to groups according to an expected erase speed. The storage elements are then erased according to their group to provide a more uniform erase depth and a tighter erase distribution. In one approach, the control gate voltages are set differently for the different groups to slow down the storage elements which are expected to have a faster programming speed. An erase or inhibit status can be set for all groups together. In another approach, the control gate voltages are common for the different groups but an erase or inhibit status is set for each group separately.

Abstract: Viscosity or rheology measuring instrument utilizing Hall Effect or like magnetic coupling with parts mounted on driving and driven rotational assemblies.

Abstract: Non-volatile storage devices and techniques for operating non-volatile storage are described herein. One embodiment includes accessing “n” pages of data to be programmed into a group of non-volatile storage elements. The “n” pages are mapped to a data state for each of the non-volatile storage elements based on a coding scheme that evenly distributes read errors across the “n” pages of data. Each of the non-volatile storage elements in the group are programmed to a threshold voltage range based on the data states to which the plurality of pages have been mapped. The programming may include programming the “n” pages simultaneously. In one embodiment, mapping the plurality of pages is based on a coding scheme that distributes a significant failure mode (for example, program disturb errors) to a first of the pages and a significant failure mode (for example, data retention errors) to a second of the pages.