Patents by Inventor Alex Margomenos

Alex Margomenos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microstrip-to-microstrip RF transition including co-planar waveguide connected by vias
    Patent number: 7315223
    Abstract: A microstrip-to-microstrip RF transition circuit that employs a wide microstrip line transition to a short co-planar waveguide section. In one embodiment, a first microstrip line and a first ground plane are patterned on a top surface of a semiconductor wafer, and a second microstrip line and a second ground plane are patterned on a bottom surface of the wafer. A signal via is formed through the wafer and makes electrical contact with the first and second microstrip lines. Likewise, at least one ground via is formed through the wafer and makes electrical contact with the first and second ground planes. A widened portion of the microstrip line is positioned between extended portions of the respective ground plane so that a slot is provided between the widened portion and the extended portion.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: January 1, 2008
    Assignee: EMAG Technologies, Inc.
    Inventor: Alex Margomenos
  • Microstrip-to-microstrip RF transition including co-planar waveguide
    Publication number: 20060214744
    Abstract: A microstrip-to-microstrip RF transition circuit that employs a wide microstrip line transition to a short co-planar waveguide section. In one embodiment, a first microstrip line and a first ground plane are patterned on a top surface of a semiconductor wafer, and a second microstrip line and a second ground plane are patterned on a bottom surface of the wafer. A signal via is formed through the wafer and makes electrical contact with the first and second microstrip lines. Likewise, at least one ground via is formed through the wafer and makes electrical contact with the first and second ground planes. A widened portion of the microstrip line is positioned between extended portions of the respective ground plane so that a slot is provided between the widened portion and the extended portion.
    Type: Application
    Filed: June 30, 2005
    Publication date: September 28, 2006
    Applicant: EMAG Technologies, Inc.
    Inventor: Alex Margomenos