Patents by Inventor Alex Minkovich
Alex Minkovich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11430680Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.Type: GrantFiled: April 18, 2019Date of Patent: August 30, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Abraham Ravid, Kevin Griffin, Joseph Yudovsky, Kaushal Gangakhedkar, Dmitry A. Dzilno, Alex Minkovich
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Publication number: 20190244842Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.Type: ApplicationFiled: April 18, 2019Publication date: August 8, 2019Inventors: Abraham Ravid, Kevin Griffin, Joseph Yudovsky, Kaushal Gangakhedkar, Dmitry A. Dzilno, Alex Minkovich
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Patent number: 10312120Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.Type: GrantFiled: March 14, 2014Date of Patent: June 4, 2019Assignee: Applied Materials, Inc.Inventors: Abraham Ravid, Kevin Griffin, Joseph Yudovsky, Kaushal Gangakhedkar, Dmitry A. Dzilno, Alex Minkovich
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Patent number: 10196741Abstract: Apparatus and methods of dimension control and monitoring between a processes fixture and a susceptor, and position determination of wafers are described.Type: GrantFiled: August 28, 2014Date of Patent: February 5, 2019Assignee: Applied Materials, Inc.Inventors: Kevin Griffin, Abraham Ravid, Alex Minkovich, Somesh Khandelwal, Joseph Yudovsky, Todd Egan
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Patent number: 9538583Abstract: Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements.Type: GrantFiled: January 16, 2013Date of Patent: January 3, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Leon Volfovski, Mayur G. Kulkarni, Alex Minkovich, Michael R. Rice
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Patent number: 9296105Abstract: Embodiments disclose a vibration-controlled robot apparatus. The apparatus includes a robot having an end effector operable to transport a substrate, a sensor coupled to the robot, the sensor operable to sense vibration as the robot transports the substrate, and operating the robot to reduce vibration of the end effector supporting the substrate. In some embodiments, a filter is provided in the motor drive circuit to filter one or more frequencies causing unwanted vibration of the end effector. Vibration control systems and methods of operating the same are provided, as are other aspects.Type: GrantFiled: November 20, 2013Date of Patent: March 29, 2016Assignee: Applied Materials Inc.Inventors: Nir Merry, Alex Minkovich, Jeffrey C. Hudgens, Brendan Till
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Publication number: 20160027675Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.Type: ApplicationFiled: March 14, 2014Publication date: January 28, 2016Inventors: Abraham RAVID, Kevin GRIFFIN, Joseph YUDOVSKY, Kaushal GANGAKHEDKAR, Dmitry A. DZILNO, Alex MINKOVICH
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Publication number: 20150376782Abstract: Apparatus and methods of dimension control and monitoring between a processes fixture and a susceptor, and position determination of wafers are described.Type: ApplicationFiled: August 28, 2014Publication date: December 31, 2015Inventors: Kevin Griffin, Abraham Ravid, Alex Minkovich, Somesh Khandelwal, Joseph Yudovsky, Todd Egan
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Patent number: 8880210Abstract: Methods and apparatus are disclosed herein. In some embodiments, methods of controlling process chambers may include predetermining a relationship between pressure in a processing volume and a position of an exhaust valve as a function of a process parameter; setting the process chamber to a first state having a first pressure in the processing volume and a first value of the process parameter, wherein the exhaust valve is set to a first position based on the predetermined relationship to produce the first pressure at the first value; determining a pressure control profile to control the pressure as the process chamber is changed to a second state having a second pressure and a second process parameter value from the first state; and applying the pressure control profile to control the pressure by varying the position of the exhaust valve while changing the process chamber to the second state.Type: GrantFiled: July 15, 2011Date of Patent: November 4, 2014Assignee: Applied Materials, Inc.Inventors: Keith Brian Porthouse, John W. Lane, Mariusch Gregor, Nir Merry, Michael R. Rice, Alex Minkovich, Hongbin Li, Dmitry A. Dzilno
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Publication number: 20140197151Abstract: Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements.Type: ApplicationFiled: January 16, 2013Publication date: July 17, 2014Applicant: APPLIED MATERIALS, INC.Inventors: LEON VOLFOVSKI, MAYUR G. KULKARNI, ALEX MINKOVICH, MICHAEL R. RICE
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Publication number: 20140156070Abstract: Embodiments disclose a vibration-controlled robot apparatus. The apparatus includes a robot having an end effector operable to transport a substrate, a sensor coupled to the robot, the sensor operable to sense vibration as the robot transports the substrate, and operating the robot to reduce vibration of the end effector supporting the substrate. In some embodiments, a filter is provided in the motor drive circuit to filter one or more frequencies causing unwanted vibration of the end effector. Vibration control systems and methods of operating the same are provided, as are other aspects.Type: ApplicationFiled: November 20, 2013Publication date: June 5, 2014Inventors: Nir Merry, Alex Minkovich, Jeffrey C. Hudgens, Brendan Till
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Publication number: 20130018500Abstract: Methods and apparatus are disclosed herein. In some embodiments, methods of controlling process chambers may include predetermining a relationship between pressure in a processing volume and a position of an exhaust valve as a function of a process parameter; setting the process chamber to a first state having a first pressure in the processing volume and a first value of the process parameter, wherein the exhaust valve is set to a first position based on the predetermined relationship to produce the first pressure at the first value; determining a pressure control profile to control the pressure as the process chamber is changed to a second state having a second pressure and a second process parameter value from the first state; and applying the pressure control profile to control the pressure by varying the position of the exhaust valve while changing the process chamber to the second state.Type: ApplicationFiled: July 15, 2011Publication date: January 17, 2013Applicant: APPLIED MATERIALS, INC.Inventors: KEITH BRIAN PORTHOUSE, JOHN W. LANE, MARIUSCH GREGOR, NIR MERRY, MICHAEL R. RICE, ALEX MINKOVICH, HONGBIN LI, DMITRY A. DZILNO
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Publication number: 20120196242Abstract: Embodiments of substrate supports with a heater and an integrated chiller are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first surface of the first member, a heater disposed beneath the first member and having one or more heating zones to provide heat to the first member, a plurality of cooling channels disposed beneath the first member to remove heat provided by the heater, a plurality of substrate support pins disposed a first distance above the first surface of the first member, the plurality of substrate support pins to support a backside surface of a substrate when present on the substrate support, and an alignment guide extending from the first surface of the first member and about the plurality of substrate support pins.Type: ApplicationFiled: January 27, 2011Publication date: August 2, 2012Applicant: APPLIED MATERIALS, INC.Inventors: LEON VOLFOVSKI, MAYUR G. KULKARNI, ALEX MINKOVICH
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Publication number: 20070251939Abstract: The present invention relates generally to control schemes for controlling the temperature of a heater plate of a thermal unit, e.g., of a track lithography tool. In accordance with certain embodiments of the invention, a cold wafer compensation offset value is added to an initial target heater plate temperature setpoint, and this setpoint plus offset is used to control the temperature of the heater plate prior to placement of a semiconductor wafer, e.g., via Proportional-Integral-Derivative (PID) control. Further, in accordance with certain embodiments, upon cold wafer placement, the temperature control is turned off until the temperature of the heater plate reaches the initial target heater plate temperature setpoint. The temperature control (e.g., PID control) is then reinstated, and the heater plate and wafer are controlled to steady state.Type: ApplicationFiled: April 27, 2006Publication date: November 1, 2007Applicant: Applied Materials, Inc.Inventors: Alex Minkovich, Natarajan Ramanan, Eehern Wong