Patents by Inventor Alex Niu

Alex Niu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process
    Patent number: 8563417
    Abstract: The invention generally relates to a packaging method of an ultra-thin chip, more specifically, the invention relates to a method for packaging the ultra-thin chip with solder ball thermo-compression in wafer level packaging process. The method starts with disposing solder balls on metal pads arranged on the front surface of semiconductor chips that are formed at the front surface of a semiconductor wafer. The solder balls are soften by heating the wafer, a compression plate is applied with a pressure on the top ends of the solder balls thus forming a co-planar top surface at the top ends of the solder balls. A molding compound is deposited on the front surface of the wafer with the top ends of the solder balls exposed. The wafer is then ground from its back surface to reduce its thickness to achieve ultra-thin chip.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: October 22, 2013
    Assignee: Alpha & Omega Semiconductor, Inc.
    Inventors: Jun Lu, Alex Niu, Yueh-Se Ho, Ping Hoang, Jacky Gong, Yan Xun Xue, Xiaolian Zhang, Ming-Chen Lu
  • METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRESSION IN WAFER LEVEL PACKAGING PROCESS
    Publication number: 20130130443
    Abstract: The invention generally relates to a packaging method of an ultra-thin chip, more specifically, the invention relates to a method for packaging the ultra-thin chip with solder ball thermo-compression in wafer level packaging process. The method starts with disposing solder balls on metal pads arranged on the front surface of semiconductor chips that are formed at the front surface of a semiconductor wafer. The solder balls are soften by heating the wafer, a compression plate is applied with a pressure on the top ends of the solder balls thus forming a co-planar top surface at the top ends of the solder balls. A molding compound is deposited on the front surface of the wafer with the top ends of the solder balls exposed. The wafer is then ground from its back surface to reduce its thickness to achieve ultra-thin chip.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Inventors: Jun Lu, Alex Niu, Yueh-Se Ho, Ping Huang, Jacky Gong, Yan Xun Xue, Xiaotian Zhang, Ming-Chen Lu