Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A liquid is placed on a surface of a semiconductor wafer on which particles may adhere. A light pulse is then applied to the surface of the semiconductor wafer through the liquid. The liquid containing the particles is then removed from the surface of the semiconductor wafer.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A liquid is placed on a surface of a semiconductor wafer on which particles may adhere. A light pulse is then applied to the surface of the semiconductor wafer through the liquid. The liquid containing the particles is then removed from the surface of the semiconductor wafer.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an electric grid is utilized to remove the particles off the surface of the wafer.

Abstract: In some implementations, a network device includes a housing and a set of switch cards within the housing and including a first set of connectors. A set of line cards within the housing includes a second set of connectors. The set of line cards are oriented orthogonally to the set of switch cards. A first set of power supplies and a second set of power supplies are in the housing. A midplane includes a plurality of circuit board assemblies arranged within the housing between the set of line cards and the first and second sets of power supplies to allow air to flow through the set of line cards to the set of switch cards, first set of power supplies, and second set of power supplies.

Abstract: In some implementations, a network device includes a housing and a set of switch cards within the housing and including a first set of connectors. A set of line cards within the housing includes a second set of connectors. The set of line cards are oriented orthogonally to the set of switch cards. A first set of power supplies and a second set of power supplies are in the housing. A midplane includes a plurality of circuit board assemblies arranged within the housing between the set of line cards and the first and second sets of power supplies to allow air to flow through the set of line cards to the set of switch cards, first set of power supplies, and second set of power supplies.

Abstract: In some implementations, a network device is provided. The network device includes a housing and a set of switch cards, mounted within the housing. The set of switch cards includes a first set of connectors. The network device also includes a set of line cards having a second set of connectors. The set of line cards are oriented parallel to each other and oriented orthogonally to the set of switch cards. The second set of connectors is coupled to the first set of connectors to couple the set of switch cards to the set of line cards. The network device further includes a first set of power supplies disposed along a left side of the housing and a second set of power supplies disposed along a right side of the housing.

Abstract: A network device is provided. The device includes a housing and a switch card, mounted within the housing and having one or more connectors. A plurality of line cards are oriented parallel to each other and orthogonal to the switch card and assembled to the one or more connectors of the switch card. The switch card has a chip, with a plurality of switches or routing paths, and the switch card and the chip couple to the plurality of line cards through the one or more connectors.

Abstract: In some implementations, a network device is provided. The network device includes a housing and a set of switch cards, mounted within the housing. The set of switch cards includes a first set of connectors. The network device also includes a set of line cards having a second set of connectors. The set of line cards are oriented parallel to each other and oriented orthogonally to the set of switch cards. The second set of connectors is coupled to the first set of connectors to couple the set of switch cards to the set of line cards. The network device further includes a first set of power supplies disposed along a left side of the housing and a second set of power supplies disposed along a right side of the housing.

Abstract: A network device is provided. The device includes a housing and a switch card, mounted within the housing and having one or more connectors. A plurality of line cards are oriented parallel to each other and orthogonal to the switch card and assembled to the one or more connectors of the switch card. The switch card has a chip, with a plurality of switches or routing paths, and the switch card and the chip couple to the plurality of line cards through the one or more connectors.

Abstract: A busbar and connector assembly is provided. The busbar and connector assembly includes a printed circuit board having an attached connector arranged to couple to a first busbar and a second busbar coupled to the connector. The busbar and connector assembly includes the connector arranged to distribute a first portion of current from the first busbar to the printed circuit board and distribute a second portion of the current from the first busbar to the second busbar.

Abstract: A busbar and connector assembly is provided. The busbar and connector assembly includes a printed circuit board having an attached connector arranged to couple to a first busbar and a second busbar coupled to the connector. The busbar and connector assembly includes the connector arranged to distribute a first portion of current from the first busbar to the printed circuit board and distribute a second portion of the current from the first busbar to the second busbar.

Abstract: A compact connector is provided. The compact connector includes a connector body having a first group of one or more pins on a first face of a contact tip and a second group of one or more pins on an opposed second face of the contact tip. The first group of one or more pins engages with a first busbar, and the second group of one or more pins engages with a second busbar, wherein when the connector engages with the busbars the contact tip is disposed between the first and second busbars. A method of using a connector is also provided.