Abstract: A method for optical metrology of a sample, the method may include illuminating areas of the sample by sets of pulses of different wavelengths, during a movement of a variable speed of the sample; collecting light reflected from the sample, as a result of the illuminating, to provide sets of frames, each set of frames comprises partially overlapping frames associated with the different wavelengths; and processing the frames to provide optical metrology results indicative of one or more evaluated parameters of elements of the areas of the sample; wherein the processing is based on a mapping between the sets of frames and reference measurements obtained by an other optical metrology process that exhibits a higher spectral resolution than a spectral resolution obtained by the illuminating and the collecting.

Abstract: An integrated metrology system for evaluating semiconductor wafers, the metrology system comprises a main body that has a rear side and a front side; the front side defines a front border of the main body; one or more detachable supporting units that are detachably coupled to the main body and support the main body while extending outside the front border; and at least one auxiliary supporting unit that is configured to support the main body at an absence of the one or more detachable supporting units