Patents by Inventor Alex T. Duncan

Alex T. Duncan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
    Patent number: 9167704
    Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: October 20, 2015
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Andy A. Hrametz, Alex T. Duncan
  • LEAD-FREE SOLDER ALLOY FOR PRINTED CIRCUIT BOARD ASSEMBLIES FOR HIGH-TEMPERATURE ENVIRONMENTS
    Publication number: 20110052444
    Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
    Type: Application
    Filed: December 13, 2006
    Publication date: March 3, 2011
    Inventors: Andy A. Hrametz, Alex T. Duncan