Patents by Inventor Alex Tain

Alex Tain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7243327
    Abstract: A method of routing connections of an integrated circuit package having a set of top side conductors and bottom side conductors. The method includes defining at least one distribution layer within the package, and positioning a set of upper vias between the set of top side conductors and the distribution layer. A set of lower vias is positioned between the distribution layer and the set of bottom side conductors that correspond to the set of top side conductors. One or more connections on the distribution layer are routed between the set of upper vias and the set of lower vias. In this manner, the one or more top side conductors are coupled automatically with their respective one or more bottom side conductors. This process may be implemented using one or more computer modules or computer operations.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: July 10, 2007
    Assignee: Cisco Technology, Inc.
    Inventors: Alex Tain, Eric Tosaya
  • Patent number: 7055122
    Abstract: A method for logically connecting at least one of a plurality of top side conductors of an integrated circuit package with at least one of a plurality of bottom side conductors of the integrated circuit package. The method includes drawing a layout of the bottom side conductors, and drawing a layout of the top side conductors. One or more rings of the top side conductors are defined, and one or more rings of the bottom side conductors are defined. One or more signal sets of the top side conductors are defined, each of said signal sets contains at least two or more top side conductors. The user can select a region of top side conductors to be connected with a region of bottom side conductors, and the selected region of top side conductors is automatically connected with the selected region of bottom side conductors while maintaining the signal set relations.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: May 30, 2006
    Assignee: Cisco Technology, Inc.
    Inventors: Alex Tain, Eric Tosaya
  • Patent number: 6976236
    Abstract: A method of routing connections of an integrated circuit package having a set of top side conductors and bottom side conductors. The method includes defining at least one distribution layer within the package, and positioning a set of upper vias between the set of top side conductors and the distribution layer. A set of lower vias is positioned between the distribution layer and the set of bottom side conductors that correspond to the set of top side conductors. One or more connections on the distribution layer are routed between the set of upper vias and the set of lower vias. In this manner, the one or more top side conductors are coupled automatically with their respective one or more bottom side conductors. This process may be implemented using one or more computer modules or computer operations.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: December 13, 2005
    Assignee: Procket Networks, Inc.
    Inventors: Alex Tain, Eric Tosaya