Patents by Inventor Alex Tselikov

Alex Tselikov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION
    Publication number: 20240085622
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • HIGH SPEED AND MULTI-CONTACT LEDS FOR DATA COMMUNICATION
    Publication number: 20240072895
    Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.
    Type: Application
    Filed: September 12, 2023
    Publication date: February 29, 2024
    Applicant: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Systems using fan-in and fan-out microLED-based interconnects
    Patent number: 11914200
    Abstract: Optical interconnect topologies may be provided using microLEDs. The topologies may interconnect ICs. The optical interconnect topologies may be used in some instances in place of electrical busses.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: February 27, 2024
    Assignee: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Packaging for microLEDs for chip to chip communication
    Patent number: 11835758
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: December 5, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • High speed and multi-contact LEDs for data communication
    Patent number: 11791896
    Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: October 17, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION
    Publication number: 20230176281
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Application
    Filed: November 28, 2022
    Publication date: June 8, 2023
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Packaging for microLEDs for chip to chip communication
    Patent number: 11513285
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: November 29, 2022
    Assignee: AVICENATECH CORP.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Optical transceiver design for short distance communication systems based on microLEDs
    Patent number: 11483182
    Abstract: MicroLEDs may be used for short-range optical communications. Signal equalization may be used to decrease distortion in transmitted and/or received information, including with the use of multi-level modulation formats.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: October 25, 2022
    Assignee: AVICENATECH CORP.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • High speed and multi-contact LEDs for data communication
    Patent number: 11418257
    Abstract: An LED may include a third contact, for example to increase speed of operation of the LED. The LED with the third contact may be used in an optical communication system, for example a chip-to-chip optical interconnect.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: August 16, 2022
    Assignee: AVICENATECH CORP.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • OPTICAL TRANSCEIVER DESIGN FOR SHORT DISTANCE COMMUNICATION SYSTEMS BASED ON MICROLEDS
    Publication number: 20210211331
    Abstract: MicroLEDs may be used for short-range optical communications. Signal equalization may be used to decrease distortion in transmitted and/or received information, including with the use of multi-level modulation formats.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION
    Publication number: 20210208337
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • SYSTEMS USING MICROLED-BASED INTERCONNECTS
    Publication number: 20210208346
    Abstract: Optical interconnect topologies may be provided using microLEDs. The topologies may interconnect ICs. The optical interconnect topologies may be used in some instances in place of electrical busses.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • HIGH SPEED AND MULTI-CONTACT LEDS FOR DATA COMMUNICATION
    Publication number: 20210151623
    Abstract: An LED may include a third contact, for example to increase speed of operation of the LED. The LED with the third contact may be used in an optical communication system, for example a chip-to-chip optical interconnect.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 20, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • HIGH SPEED AND MULTI-CONTACT LEDS FOR DATA COMMUNICATION
    Publication number: 20210152244
    Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p? doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 20, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov