Patents by Inventor Alex Y. WANG

Alex Y. WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot melt adhesive composition with ethylene/?-olefin multi-block copolymer
    Patent number: 9969912
    Abstract: The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/?-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: May 15, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Colin LiPiShan, Cynthia L. Rickey, Alex Y. Wang
  • Hot Melt Adhesive Composition with Ethylene/a-Olefin Multi-Block Copolymer
    Publication number: 20160304756
    Abstract: The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/?-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.
    Type: Application
    Filed: December 22, 2014
    Publication date: October 20, 2016
    Inventors: Colin LIPI SHAN, Cynthia L. RICKEY, Alex Y. WANG