Patents by Inventor Alexander Bleakie

Alexander Bleakie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for calculating substrate support temperature
    Patent number: 10725485
    Abstract: A temperature controller for a substrate support in a substrate processing system includes a power parameter module configured to calculate a power parameter indicative of power supplied to the substrate support. A coolant temperature parameter module configured to calculate a coolant temperature parameter indicative of a temperature of a coolant supplied to the substrate support. A heat transfer gas parameter module is configured to calculate a heat transfer gas parameter indicative of flow rates of a heat transfer gas supplied to the substrate support. A temperature calculation module is configured to calculate a temperature of the substrate support using the power parameter, the coolant temperature parameter, and the heat transfer gas parameter.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: July 28, 2020
    Assignee: LAM RESEARCH CORPORATION
    Inventors: David Joseph Wetzel, Alexander Bleakie, Jacob Frederick Theisen
  • SYSTEM AND METHOD FOR CALCULATING SUBSTRATE SUPPORT TEMPERTURE
    Publication number: 20180173255
    Abstract: A temperature controller for a substrate support in a substrate processing system includes a power parameter module configured to calculate a power parameter indicative of power supplied to the substrate support. A coolant temperature parameter module configured to calculate a coolant temperature parameter indicative of a temperature of a coolant supplied to the substrate support. A heat transfer gas parameter module is configured to calculate a heat transfer gas parameter indicative of flow rates of a heat transfer gas supplied to the substrate support. A temperature calculation module is configured to calculate a temperature of the substrate support using the power parameter, the coolant temperature parameter, and the heat transfer gas parameter.
    Type: Application
    Filed: November 28, 2017
    Publication date: June 21, 2018
    Inventors: David Joseph Wetzel, Alexander Bleakie, Jacob Frederick Theisen