Abstract: The present disclosure relates to a beverage machine for preparing a single serving of a mixed beverage and a capsule for use with the machine. The capsule includes an open shell defining a reservoir for holding ingredients; a lid for sealing the open shell; and, a guide member disposed within the reservoir of the open shell configured to receive a liquid stream injected by an injection needle of a beverage machine when the lid is pierced by the injection needle and to guide the liquid stream to a mixing zone within the reservoir for mixing the liquid stream with the liquid held in the reservoir to prepare a single serving of mixed beverage to be dispensed from the reservoir via a dispensing needle of the beverage machine when the dispensing needle pierces the open shell . . . .

Abstract: The invention provides a system and methods for the delivery of streamed content over a network. The system and methods of the invention are suited for the delivery of streaming video content over a network at a variety of data rates. The system allows a user to dynamically select the quality level of data to be delivered while a video is being displayed. Moreover, the system also can automatically select content suitable for a client device's connection speed as well as hardware, software, network and firewall configurations.

Abstract: Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.

Abstract: Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.

Abstract: Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.