Patents by Inventor Alexander C. Klein

Alexander C. Klein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250059960
    Abstract: A deployable panel is provided comprising a first subpanel, a second subpanel, and a shape memory alloy hinge connecting the subpanels. The shape memory alloy hinge enables the subpanels to move between a position in which the first and second subpanels are folded over each other and an unfolded position in response to an energy source that changes the shape of the shape memory alloy hinge, wherein the unfolded position is trained into the shape memory alloy hinge to ensure precise kinematic mating between the subpanels. Shape memory alloy springs are connected to the first subpanel and respective tethers connect the shape memory alloy springs to the second subpanel. The shape memory alloy springs contract in response to a second energy source to pull the subpanels together via the tethers when the subpanels are in the unfolded position to produce a seamless, featureless surface of the deployable panel.
    Type: Application
    Filed: September 19, 2023
    Publication date: February 20, 2025
    Inventors: Christopher R. Shurilla, Zackary L. Endsley, John C. Mooney, Steven Fulton Griffin, Alexander C. Klein, Frederick Theodore Calkins
  • Patent number: 12228114
    Abstract: A deployable panel is provided comprising a first subpanel, a second subpanel, and a shape memory alloy hinge connecting the subpanels. The shape memory alloy hinge enables the subpanels to move between a position in which the first and second subpanels are folded over each other and an unfolded position in response to an energy source that changes the shape of the shape memory alloy hinge, wherein the unfolded position is trained into the shape memory alloy hinge to ensure precise kinematic mating between the subpanels. Shape memory alloy springs are connected to the first subpanel and respective tethers connect the shape memory alloy springs to the second subpanel. The shape memory alloy springs contract in response to a second energy source to pull the subpanels together via the tethers when the subpanels are in the unfolded position to produce a seamless, featureless surface of the deployable panel.
    Type: Grant
    Filed: September 19, 2023
    Date of Patent: February 18, 2025
    Assignee: The Boeing Company
    Inventors: Christopher R. Shurilla, Zackary L. Endsley, John C. Mooney, Steven Fulton Griffin, Alexander C. Klein, Frederick Theodore Calkins