Abstract: A method and system for adjusting properties of another system based on a risk score associated with an entity, using a framework comprising a server having a risk determinator, an API, and storage for storing a risk profile associated with the entity and a risk property associated the risk profile. The method is performed by the server, and comprises obtaining, from the storage, the risk profile associated with the entity, where the risk profile is generated by a risk determinator, and based on at least one risk property. The risk determinator generates the risk score associated with the entity based on the risk profile, and the server determines an adjustment to the properties of the system based on at least the risk score. The adjustment is output, through the API to the other system.

Abstract: A method and server system for determining unauthorised requests, from a sender, for data pertaining to a recipient of an electronic communication, wherein the recipient is a user of, and has an authorized account with, the server system. The server system is configured to determine that the electronic communication is a potentially malicious communication, and then instantiate a pseudo account with associated login credentials associated with, and unused by, the recipient. Login credentials associated with the pseudo account are transmitted to the sender and access to the pseudo account is monitored. Characteristics of the access are associated with the pseudo account and then used to determine unauthorized requests for the data.

Abstract: The present invention relates to a method of (and system for) characterizing the permeation of a permeant of interest between a first liquid or semi-solid and a second liquid across an interface (eg through a membrane) by using UV imaging.

Abstract: The present invention relates to a method of (and system for) characterising the permeation of a permeant of interest between a first liquid or semi-solid and a second liquid across an interface (eg through a membrane) by using UV imaging.

Abstract: Methods and systems for processing collaterals are described. A method may include receiving qualifying criteria from a client. The qualifying criteria may define assignments of one or more collaterals. An assignment tool may be generated based on the qualifying criteria. The assignment tool may include a number of stored attributes and one or more interaction attribute to be determined based on a customer interaction. The assignment tool may be used to assign a collateral to a customer. Additional methods and systems are disclosed.

Abstract: Techniques are presented for two-phase commit of electronic mail (email) processing. An email service interacts with a sender's service to prepare and commit emails. An email is not sent to a recipient until a commit is received from the sender's service. The sender's service records responses from the email service for tracking whether the emails are successfully sent or failed to be sent to their intended recipients.

Abstract: An isotropic or partially isotropic etch shrinks lithographically patterned photoresist (211, 212) to yield reduced linewidth patterned photoresist (213, 214) with a buried antireflective coating also acting as an etchstop or a sacrificial layer. The reduced linewidth pattern (213, 214) provide an etch mask for subsequent anisotropic etching of underlying material such as polysilicon (206) or metal or insulator or ferroelectric.

Abstract: This disclosure defines an infrared image detector formed in a block of semiconductor material by etching slots in the semiconductor material. The slots define the individual detectors, effectively isolate them from each other both optically and electrically, and permit the detectors to be placed very close to each other. Biasing slots are etched in each detector and on two opposing sides of the detector and the walls of the slots are made highly conductive by an impurity diffusion or coating or alternatively the slots is filled with a conducting material. The conducting layer or material in each slot is connected to a conductor on the surface of the semiconductor wafer so that the conductor inside the biasing slot serves as an electrical contact for the detector. The detectors are biased electrically by applying a voltage difference between two different sets of conducting slots.