Abstract: A method for connecting two connection partners includes: moving a second connection partner towards a first connection partner and simultaneously heating a first section of the second connection partner to soften the first section; and placing the second connection partner on the first connection partner such that the softened first section of the second connection partner directly contacts the first connection partner.

Abstract: A method for fabricating a substrate comprising a solder stop structure comprises providing a substrate configured to carry a surface mounted device, the substrate comprising a ceramic layer and a metallization arranged on the ceramic layer, wherein the metallization comprises a base metal layer and a noble metal layer covering the base metal layer, and generating an oxidation structure on the metallization, wherein the oxidation structure divides the metallization into a first part and a second part, and wherein the oxidation structure is configured to act as a solder stop, wherein generating the oxidation structure comprises partially removing the noble metal layer.

Abstract: One aspect of the invention relates to producing a dried paste layer on a joining partner. For this purpose, a joining partner having a contact surface is provided, to which contact surface a paste is applied. Furthermore, a heating device is provided, which is preheated to a preheating temperature. The paste applied to the contact surface is then dried during a drying phase, such that a dried paste layer arises from the paste. In the drying phase, the joining partner and the preheated heating device are at a distance of at most 5 mm.

Abstract: A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate.

Abstract: A semiconductor device includes a substrate including a first metal layer, a first semiconductor chip having sidewalls, and a first solder layer contacting the first semiconductor chip and the first metal layer. The first metal layer includes a groove extending around sidewalls of the first semiconductor chip. The groove is at least partly filled with excess solder from the first solder layer.

Abstract: A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate.

Abstract: A semiconductor device includes a substrate including a first metal layer, a first semiconductor chip having sidewalls, and a first solder layer contacting the first semiconductor chip and the first metal layer. The first metal layer includes a groove extending around sidewalls of the first semiconductor chip. The groove is at least partly filled with excess solder from the first solder layer.

Abstract: A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housing, and an external portion which is arranged outside the housing. The internal portion is electrically coupled to an electric component of the power semiconductor module. The external portion allows for electrically coupling the power semiconductor module.

Abstract: A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housing, and an external portion which is arranged outside the housing. The internal portion is electrically coupled to an electric component of the power semiconductor module. The external portion allows for electrically coupling the power semiconductor module.

Abstract: According to an embodiment, a press-fit connector includes a first part with a first end and with a second end, and a second part with a first end and with a second end. The second end of the first part is electrically and mechanically joined to the first end of the second part. The first part is made of a first material with a first mechanical strength. The second part is made of a second material with a second mechanical strength. The first mechanical strength is greater than the second mechanical strength.