Abstract: An electronic device with a multi-layer contact and a system is disclosed. In an embodiment, a semiconductor device includes a semiconductor substrate having a first electrode terminal located on a first surface and a second surface electrode terminal located on a second surface, the first surface being opposite to the second surface, an electrical contact layer disposed directly on the first electrode terminal, a functional layer directly disposed on the electrical contact layer, an adhesion layer directly disposed on the functional layer, a solder layer directly disposed on the adhesion layer; and a protection layer directly disposed on the solder layer, wherein the semiconductor device is a power semiconductor device configured to provide a vertical current flow.

Abstract: A coupling link (18) for a hinged roll bar (12) has first and second cover plates (24, 26) spaced apart from each other. An axle bearing (32, 50) is connected to the two cover plates (24) for forming a rotary joint (40) with a first link lever (14) that can be mounted on the axle bearing (32, 50). The coupling link (18) has, in the region of the rotary joint (40), a reinforcing element (42) that forms a support of the first link lever (14).

Abstract: A coupling link (18) for a hinged roll bar (12) has first and second cover plates (24, 26) spaced apart from each other. An axle bearing (32, 50) is connected to the two cover plates (24) for forming a rotary joint (40) with a first link lever (14) that can be mounted on the axle bearing (32, 50). The coupling link (18) has, in the region of the rotary joint (40), a reinforcing element (42) that forms a support of the first link lever (14).