Abstract: A process and apparatus for bonding lead wires to a metal substrate. A lead wire is positioned on the substrate and a spot of metal is deposited over a portion of the lead wire and metal substrate to firmly bond the wire to the substrate.

Abstract: A process and apparatus for electroplating a spot of metal on a substrate and optionally a plurality of such spots in a desired arrangement. A column of electrolyte having a transverse cross-sectional shape corresponding about to the shape of the desired spot of metal to be plated is formed between an anode and the substrate which is connected as a cathode. The electrolyte is supplied by force of gravity with a desired hydrostatic head pressure. The substrate can be sequentially advanced to electrodeposit spots of metal at different points on the substrate.

Abstract: A multi-component metal electrode and a method for its preparation is described in which a film-forming metal base such as titanium is coated with an oxide of a film-forming metal, and then further coated with a conductive oxide, such as ruthenium oxide. A corrosion resistant oxide such as tantalum oxide, is applied to the ruthenium oxide.The corrosion-resistant metal oxide is formed by applying to the ruthenium oxide a solution of an inorganic compound of the corrosion-resistant metal, and heating the solution-coated electrode to evaporate the solvent and form a corrosion-resistant metal oxide.The resulting multi-component metal electrode of this invention can be used as an electrode in mercury cells and diaphragm cells.