Abstract: A bifacial photovoltaic module with at least one bifacial solar cell is provided. The at least one bifacial solar cell includes a substrate with a front-side and a rear-side. The front-side is the light incident side and the rear-side has rear-side contact structure. The rear-side contact structure includes a plurality of electrically conductive contact fingers, which have a first metal, a plurality of solder pads electrically connected to the contact fingers. The solder pads have a top. The solder pads have a second metal, which is different from the first metal. The rear-side contact structure further includes several cell connectors electrically connected to the solder pads. The top of the solder pads is free from the contact fingers in an area along one direction. The cell connectors are disposed planar on or above this area.

Abstract: In various embodiments, a photovoltaic module is provided. The photovoltaic module may include a plurality of electrically coupled photovoltaic cell, the photovoltaic cells being arranged next to each other such that a cell gap is formed between the photovoltaic cells in each case, a transparent front cover and a transparent rear cover between which the photovoltaic cells are arranged, a marginal gap being formed between the edge of the covers and the photovoltaic cells directly adjacent thereto, and at the back of the cell, a structure which at least partially covers at least one of a cell gap or a marginal gap, the structure having a decreasing coverage in the direction of a respective photovoltaic cell.

Abstract: A bifacial photovoltaic module with at least one bifacial solar cell is provided. The at least one bifacial solar cell includes a substrate with a front-side and a rear-side. The front-side is the light incident side and the rear-side has rear-side contact structure. The rear-side contact structure includes a plurality of electrically conductive contact fingers, which have a first metal, a plurality of solder pads electrically connected to the contact fingers. The solder pads have a top. The solder pads have a second metal, which is different from the first metal. The rear-side contact structure further includes several cell connectors electrically connected to the solder pads. The top of the solder pads is free from the contact fingers in an area along one direction. The cell connectors are disposed planar on or above this area.

Abstract: A solar cell array is made of a plurality of bifacial PERC solar cells, respectively formed in a semiconductor body, which are electrically interconnected by way of cell connectors. A structured passivation layer is applied on the rear-side surface of the semiconductor body, on which the current collecting rails and contact finger contacting the semiconductor body are provided. A respective cell connector extends at least partially along a longitudinal direction of at least one current collecting rail and electrically contacts this on at least one solder contact via a solder joint. A lateral width of a current collecting rail is at least partially greater than a lateral width of the cell connector covering this current collecting rail.

Abstract: A photovoltaic module has a number of solar cells, which respectively include a contact structure on a pre-processed silicon wafer, which has a number of linear contact fingers disposed in parallel in a first direction and at least one bus bar disposed perpendicular to the first direction. The bus bar extends over the contact finger in a second direction and has a respective contact surface in the region of the contact finger, which protrudes above the contact finger in the second direction and is electrically connected to the contact fingers. At least one cell connector is provided for connecting the solar cells, which extends over the bus bar of at least one solar cell and is electrically connected to the contact surfaces of the bus bar, wherein the width of the cell connector is smaller than the length of the contact surface in the first direction.

Abstract: A semiconductor component, especially a solar cell comprises a semiconductor substrate of a planar design having a first side and a second side lying opposite thereto, at least one contact structure arranged on at least one side of the semiconductor substrate, the at least one contact structure exhibiting a diffusion barrier to prevent the diffusion of ions from the contact structure into the semiconductor substrate.

Abstract: In various exemplary embodiments, a solar cell is provided, including a layer structure having at least one photovoltaic layer; and a plurality of contact wires running on the surface of the layer structure. The contact wires are wire-bonded radially with respect to their axis onto the surface of the layer structure.

Abstract: An apparatus for coating a substrate with a layer of inhomogeneous but continuous thickness is provided. The apparatus may include a holding device configured to hold a substrate to be coated; a coating device comprising at least one coating source for providing a coating material, which is arranged at a distance from the holding device; and at least one magnetizing device configured to generate a predetermined magnetic field in the region between the substrate to be coated and the coating source. The magnetizing device may be arranged on the opposite side of the holding device to the coating source.

Abstract: A method for producing a semiconductor component with an easily solderable contact structure comprising the provision of a semiconductor substrate of a planar design with a first side, a second side, a surface normal standing vertically thereon, a dielectric passivation layer arranged on at least one of the sides and a first contact layer arranged on passivation layer, the application, at least in some areas, of at least one second contact layer onto the first contact layer, the at least one second contact layer comprising at least a partial layer made of an easily solderable metal, especially of nickel and/or silver and/or tin and/or a compound thereof, and the making of an electrically conductive contact between the second contact layer and the semiconductor substrate.

Abstract: A semiconductor component, especially a solar cell comprises a semiconductor substrate of a planar design having a first side and a second side lying opposite thereto, at least one contact structure arranged on at least one side of the semiconductor substrate, the at least one contact structure exhibiting a diffusion barrier to prevent the diffusion of ions from the contact structure into the semiconductor substrate.