Abstract: The present invention provides an optical array module that includes a plurality of semiconductor devices mounted on a thermal substrate formed with a plurality of openings that function as micro-reflectors, wherein each micro-reflector includes a layer of reflective material to reflect light. Such material preferably is conductive so as to provide electrical connection for its associated semiconductor device.

Abstract: The present invention provides an optical array module that includes a plurality of semiconductor devices mounted on a thermal substrate formed with a plurality of openings that function as micro-reflectors, wherein each micro-reflector includes a layer of reflective material to reflect light. Such material preferably is conductive so as to provide electrical connection for its associated semiconductor device.

Abstract: The present invention provides an optical array module that includes a plurality of semiconductor devices mounted on a thermal substrate formed with a plurality of openings that function as micro-reflectors, wherein each micro-reflector includes a layer of reflective material to reflect light. Such material preferably is conductive so as to provide electrical connection for its associated semiconductor device.

Abstract: The present invention provides an optical array module that includes a plurality of semiconductor devices mounted on a thermal substrate formed with a plurality of openings that function as micro-reflectors, wherein each micro-reflector includes a layer of reflective material to reflect light. Such material preferably is conductive so as to provide electrical connection for its associated semiconductor device.

Abstract: The present invention provides an optical array module that includes a plurality of semiconductor devices mounted on a thermal substrate formed with a plurality of openings that function as micro-reflectors, wherein each micro-reflector includes a layer of reflective material to reflect light. Such material preferably is conductive so as to provide electrical connection for its associated semiconductor device.

Abstract: A method of controlling thermal loading of an electronic component material during ablation thereof provides a first laser light beam 42 at a certain power density and fluence and uses the first laser light beam to remove a portion of a first side 47 of the material 36. A second laser light beam 44 is provided at a certain power density and fluence and the second laser light beam is used to remove a portion of a side 49 of the material opposing the first side thereof substantially simultaneously as the portion of the first side is being removed.

Abstract: A method of controlling thermal loading of an electronic component material during ablation thereof provides a first laser light beam 42 at a certain power density and fluence and uses the first laser light beam to remove a portion of a first side 47 of the material 36. A second laser light beam 44 is provided at a certain power density and fluence and the second laser light beam is used to remove a portion of a side 49 of the material opposing the first side thereof substantially simultaneously as the portion of the first side is being removed.

Abstract: An upcollimator structure 28 for a laser system 10 is provided. The upcollimator structure 28 includes at least one concave lens 40; at least one convex lens 42 spaced from the concave lens; and at least one lens member 48 composed at least in part of piezoelectric material disposed between the lenses. When voltage is applied to the lens member 48, a refractive index of the lens member changes thus changing an upcollimation factor when a light beam is passed through the upcollimator structure. The lens member can be moved with respect to the convex lens and the concave lens thereby changing the upcollimation and focal point of the light beam as the light beam exits the optical.

Abstract: An upcollimator structure 28 for a laser system 10 is provided. The upcollimator structure 28 includes at least one concave lens 40; at least one convex lens 42 spaced from the concave lens; and at least one lens member 48 composed at least in part of piezoelectric material disposed between the lenses. When voltage is applied to the lens member 48, a refractive index of the lens member changes thus changing an upcollimation factor when a light beam is passed through the upcollimator structure. The lens member can be moved with respect to the convex lens and the concave lens thereby changing the upcollimation and focal point of the light beam as the light beam exits the optical.