Patents by Inventor Alexander Filbert

Alexander Filbert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Accommodating device for retaining wafers
    Patent number: 11756818
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: September 12, 2023
    Assignee: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • ACCOMMODATING DEVICE FOR RETAINING WAFERS
    Publication number: 20220262663
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Application
    Filed: May 3, 2022
    Publication date: August 18, 2022
    Applicant: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • Accommodating device for retaining wafers
    Patent number: 11355374
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: June 7, 2022
    Assignee: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • ACCOMMODATING DEVICE FOR RETAINING WAFERS
    Publication number: 20210104425
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Application
    Filed: November 30, 2020
    Publication date: April 8, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • Accomodating device for retaining wafers
    Patent number: 10886156
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: January 5, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • ACCOMODATING DEVICE FOR RETAINING WAFERS
    Publication number: 20190206711
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Application
    Filed: February 25, 2019
    Publication date: July 4, 2019
    Applicant: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • Accommodating device for retaining wafers
    Patent number: 10325798
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: June 18, 2019
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • Accommodating device for retaining wafers
    Patent number: 9312161
    Abstract: A receiving means for receiving and mounting of wafers. The receiving means includes a mounting surface. A mounting means is provided for mounting a wafer on the mounting surface. A compensation means is provided for active, especially locally controllable, at least partial compensation of local and/or global distortions of the wafer.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: April 12, 2016
    Assignee: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • ACCOMMODATING DEVICE FOR RETAINING WAFERS
    Publication number: 20150228521
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Application
    Filed: April 22, 2015
    Publication date: August 13, 2015
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Markus WIMPLINGER, Thomas WAGENLEITNER, Alexander FILBERT
  • ACCOMMODATING DEVICE FOR RETAINING WAFERS
    Publication number: 20130330165
    Abstract: A receiving means for receiving and mounting of wafers, comprised of: a mounting surface, mounting means for mounting a wafer on the mounting surface and compensation means for active, especially locally controllable, at least partial compensation of local and/or global distortions of the wafer.
    Type: Application
    Filed: December 20, 2010
    Publication date: December 12, 2013
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • RETAINING SYSTEM FOR RETAINING AND HOLDING A WAFER
    Publication number: 20130270756
    Abstract: This invention relates to a retaining system for retaining and holding a wafer for processing the wafer with a holding surface for placing the wafer on a support surface of the wafer and holding means for holding the wafer, whereby because of the holding means holding extremely thin wafers on the holding surface of the wafer, the smallest possible local distortions of the wafer are achieved.
    Type: Application
    Filed: December 14, 2010
    Publication date: October 17, 2013
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert