Abstract: Microfluidic devices having an electrowetting configuration and an optimized droplet actuation surface are provided. The devices include a conductive substrate having a dielectric layer, a hydrophobic layer covalently bonded to the dielectric layer, and a first electrode electrically coupled to the dielectric layer and configured to be connected to a voltage source. The microfluidic devices also include a second electrode configured to be connected to the voltage source. The hydrophobic layer features self-associating molecules covalently bonded to a surface of the dielectric layer in a manner that produces a densely-packed monolayer that resists intercalation and or penetration by polar molecules or species.

Abstract: An embodiment of the invention may include a semiconductor structure, method of use and method of manufacture. The structure may include a heating element located underneath a temperature-controlled portion of the device. A method of operating the semiconductor device may include providing current to a thin film heater located beneath a temperature-controlled region of the semiconductor device. The method may include performing temperature dependent operations in the temperature-controlled region.

Abstract: A system for stable and streamlined transaction approval includes a rule management server and an authorizer server that operates independently of the rule management server. The rule management server is configured to receive a transaction rule associated with an account specified by a client entered through a portal generated by a graphical user interface. The server is further configured to identify data relevant to the transaction rule and transmit the transaction rule and the data identified to an authorizer server. The authorizer server is configured to receive transaction data related to a pending transaction of the credit card and apply the transaction rule to the transaction data and the data identified by the rule management server to determine whether to approve the pending transaction. The authorizer server operates independent of the rule management server and can be optimized to approve transactions quickly and operate in a stable condition.

Abstract: A semiconductor structure comprises a gate structure of a transistor. The gate structure comprises a gate conductive portion disposed on a gate dielectric layer. The semiconductor structure further comprises a capacitor structure disposed on the gate structure. The capacitor structure comprises a first conductive layer, a dielectric layer disposed on the first conductive layer and a second conductive layer disposed on the dielectric layer. The first and second conductive layers are respectively connected to a first contact portion and a second contact portion.

Abstract: Shredded whole grain products, such as ready-to-eat cereals, and sweet and savory snacks, such as whole grain shredded corn chips are continuously produced by pelletizing agglomerates of cooked, tempered, whole cereal grain particles. Cooked whole grains, such as corn and other non-gluten or low-gluten containing grains have a tendency to become hard and rubbery after cooking during the cooling and tempering process. The pelletization results in the production of whole grain pellets having a soft, pliable texture, which are shreddable into continuous net-like sheets on a mass production basis. The pelletizing may be at a pressure of about 200 psig to about 600 psig, preferably from about 400 psig to about 500 psig. The pelletizing temperature may be controlled to provide a pellet temperature of about 80° F. to about 120° F., preferably from about 90° F. to about 110° F., upon exiting the pelletizer.

Abstract: Shredded whole grain products, such as ready-to-eat cereals, and sweet and savory snacks, such as whole grain shredded corn chips are continuously produced by pelletizing agglomerates of cooked, tempered, whole cereal grain particles. Cooked whole grains, such as corn and other non-gluten or low-gluten containing grains have a tendency to become hard and rubbery after cooking during the cooling and tempering process. The pelletization results in the production of whole grain pellets having a soft, pliable texture, which are shreddable into continuous net-like sheets on a mass production basis. The pelletizing may be at a pressure of about 200 psig to about 600 psig, preferably from about 400 psig to about 500 psig. The pelletizing temperature may be controlled to provide a pellet temperature of about 80° F. to about 135° F., preferably from about 90° F. to about 110° F., upon exiting the pelletizer.

Abstract: Shredded whole grain products, such as ready-to-eat cereals, and sweet and savory snacks, such as whole grain shredded corn chips are continuously produced by pelletizing agglomerates of cooked, tempered, whole cereal grain particles. Cooked whole grains, such as corn and other non-gluten or low-gluten containing grains have a tendency to become hard and rubbery after cooking during the cooling and tempering process. The pelletization results in the production of whole grain pellets having a soft, pliable texture, which are shreddable into continuous net-like sheets on a mass production basis. The pelletizing may be at a pressure of about 200 psig to about 600 psig, preferably from about 400 psig to about 500 psig. The pelletizing temperature may be controlled to provide a pellet temperature of about 80° F. to about 135° F., preferably from about 90° F. to about 110° F., upon exiting the pelletizer.