Abstract: A method for assembling semiconductor packages (10) includes forming corresponding pairs of conductive pads (14, 16, 20, 22) on respective surfaces of a die (12) and an interconnective substrate (18). Each pad in each pair includes an upper portion comprising at least one component of an electrically conductive eutectic alloy. Sharp, upstanding peaks (50, 58) are formed on at least one of the pads in each pair. The die and substrate are forcefully abutted and the pads heated until the sharp peaks penetrate through oxide films (52) on the respective opposing pads in each pair and contact the upper surface of the other pad therein, thereby initiating pad fusion. The pads are then cooled to solidify the molten portions thereof into an electrically conductive joint between each corresponding pair of pads and a hermetic seal around the periphery of the package.

Abstract: A driver with automatic speed and torque switching including two different drive trains which operate in parallel and are driven at the same time by a motor. One drive train provides a high-speed output while the other provides a low-speed output. A single drive head for transmitting torque to the nut is normally coupled to the high-speed output, and not to the low-speed output. The machine operates initially at the high speed for the "free rotation" of the nut. When the nut contacts the surface of the structural body, the drive coupling to the high-speed output is disabled, and the low-speed output (which formerly was not coupled to the drive head) is not at the same time coupled to the drive head. The nut is then driven much more slowly but with a higher driving torque. Within the low-speed drive train there is included a friction clutch, and adjustement means for adjusting the level of torque at which it will slip.

Abstract: A rotary assembly includes a shaft, a housing, and a bearing interposed between shaft and housing to provide radial support while also permitting relative rotation.The invention permits optimum operation of the bearing, by permitting the bearing to be self-positioned even though slightly out of alignment with either the shaft or the housing, or both.This is accomplished by providing a radial space between the bearing and the shaft or housing; placing a generally ring-shaped compensating member in circumferential engagement with the associated cylindrical surface of the shaft or housing; providing a longitudinal taper on the outer surface of the associated end of the bearing; and then placing the tapered surface of the bearing in overlapping engagement with the compensating member and resiliently urging the bearing and the compensating member axially together so as to provide a firm support both radially and axially for the bearing.

Abstract: In a manufacturing operation, a stretched diaphragm is used to support a quantity of small parts which are individually secured to the diaphragm in predetermined spaced relation. An individual part is elevated relative to the remainder of the array, for purpose of inspection or test, by displacing and even further stretching the associated portion of the diaphragm; then it is permitted to return to its original place in the array. When the parts are to be incorporated into manufactured assemblies each selected part is again elevated by displacing and stretching the associated portion of the diaphragm. The method is applied to the manufacture of microminiature electric circuits in which a flat wafer is first formed, and the wafer is then cut into a number of chips which must be individually tested and then they are incorporated into circuit assemblies.

Abstract: In securing a semiconductor chip to a substrate of ceramic material or the like, a de-focused laser beam having a wave length to which the substrate is substantially opaque is directed over a relatively large area of the reverse side of the substrate. Heat generated at the reverse side of the substrate then flows through the substrate to heat bonding material that is placed between the engaging surfaces of the chip and substrate. In this manner direct heating of the chip is avoided or minimized, and damage to both chip and substrate is also minimized.

Abstract: A mechanism for quickly and precisely positioning one body relative to another body, which relies upon three support points between the two bodies. At a first point a hemispherical surface is received in an opening having the form of a trihedral pyramid. At a second support point a hemispherical surface is received in an opening having the form of a diahedral prism. At the third support point a rigid sphere held in loose confinement engages a flat surface.

Abstract: A method of coating a thin layer of a liquid material on a substrate, in which the substrate is placed in an atmosphere saturated with the vapor of a solvent for the coating material, liquid coating material is deposited on the substrate, and then the substrate is spun to disperse the coating material into a thin film while causing the excess to run off. The vaporous solvent atmosphere is maintaind while the coating and run-off are completed. Then the substrate is isolated from the source of the solvent vapor and is heated in order to dry the coating.Apparatus for carrying out this method includes a coating chamber, a carrier adapted to receive and support the substrate, a turntable within the coating chamber for rotating the substrate carrier, and means in the coating chamber for generating the vaporous atmosphere.

Abstract: In a manufacturing operation, a stretched diaphragm is used to support a quantity of small parts which are individually secured to the diaphragm in predetermined spaced relation. An individual part is elevated relative to the remainder of the array, for purpose of inspection or test, by displacing and even further stretching the associated portion of the diaphragm; then it is permitted to return to its original place in the array. When the parts are to be incorporated into manufactured assemblies each selected part is again elevated by displacing and stretching the associated portion of the diaphragm. The method is applied to the manufacture of microminiature electric circuits in which a flat wafer is first formed, and the wafer is then cut into a number of chips which must be individually tested and then they are incorporated into circuit assemblies.