Patents by Inventor Alexander H. C. Chang

Alexander H. C. Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite lead frame manufacturing method
    Patent number: 5452511
    Abstract: A method for constructing a composite lead frame (10) wherein a plurality of lead segments (14) are separately constructed and then attached to a frame member (12). A plurality of the frame members (12) may optionally be produced as a lead frame strip (16). Each of the frame members (12) has an opposed pair of side rails (18) and a pair of cross members (20) for enclosing a lead area (22) wherein the lead segments (14) are affixed to the side rails (18) and the cross members (20) by a plurality of assembly tabs (40).
    Type: Grant
    Filed: November 4, 1993
    Date of Patent: September 26, 1995
    Inventor: Alexander H. C. Chang
  • Semiconductor package with segmented lead frame
    Patent number: 5281849
    Abstract: An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which have planes (22) attached to at least some of the associated individual leads (28). Segmentation of the lead frame (14) allows for the use of planes in inexpensive plastic and ceramic packages. Segmentation further allows the use of inexpensive aluminized stripes (42) to aluminize portions of individual leads (28) even in quad package configurations. An alternate equally preferred segmented lead frame (514) is provided for those applications wherein asymmetrical lead frames are required. Segmentation of the alternate segmented lead frame (514) permits the use of planes (522) and (552), while also limiting the cost of producing the alternate lead frame (514) especially when the etching method of production is required.
    Type: Grant
    Filed: May 7, 1991
    Date of Patent: January 25, 1994
    Inventors: Narendra N. Singh Deo, Alexander H. C. Chang
  • Method of making semiconductor package with segmented lead frame
    Patent number: 5263242
    Abstract: An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which have planes (22) attached to at least some of the associated individual leads (28). Segmentation of the lead frame (14) allows for the use of planes in inexpensive plastic and ceramic packages. Segmentation further allows the use of inexpensive aluminized stripes (42) to aluminize portions of individual leads (28) even in quad package configurations. An alternate equally preferred segmented lead frame (514) is provided for those applications wherein asymmetrical lead frames are required. Segmentation of the alternate segmented lead frame (514) permits the use of planes (522) and (552), while also limiting the cost of producing the alternate lead frame (514) especially when the etching method of production is required.
    Type: Grant
    Filed: January 4, 1993
    Date of Patent: November 23, 1993
    Assignee: CN Industries Ltd.
    Inventors: Narendra N. Singh Deo, Alexander H. C. Chang