Patents by Inventor ALEXANDER HENSLER
ALEXANDER HENSLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973434Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.Type: GrantFiled: August 6, 2020Date of Patent: April 30, 2024Assignee: Siemens AktiengesellschaftInventors: Alexander Hensler, Philipp Oschmann, Hubert Schierling
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Publication number: 20240113637Abstract: A commutation cell for a flying capacitor module, to a flying capacitor module having the commutation cell and to a multi-level converter having the flying capacitor module is disclosed. The commutation cell includes a circuit board, two semiconductors mounted either on the same side or on opposite sides of the circuit board, four capacitors arranged in pairs on opposite sides of the circuit board, and flying capacitors connected to the input and output sides of the commutation cell, respectively. The capacitors located on opposite sides are connected to one another by way of via holes. Different commutation paths between the various capacitors extend on the first side and on the second side of the circuit board and along the vias, with currents flowing through the respective adjacent capacitors in opposing directions for an overall reduction in the parasitic inductances.Type: ApplicationFiled: December 21, 2021Publication date: April 4, 2024Applicant: Siemens AktiengesellschaftInventors: Raphael Hartwig, ALEXANDER HENSLER
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Patent number: 11756857Abstract: An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.Type: GrantFiled: June 5, 2020Date of Patent: September 12, 2023Assignee: Siemens AktiengesellschaftInventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Stefan Pfefferlein
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Patent number: 11723177Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.Type: GrantFiled: October 31, 2019Date of Patent: August 8, 2023Assignee: Siemens AktiengesellschaftInventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Ewgenij Ochs, Philipp Oschmann, Stefan Pfefferlein, Ulrich Wetzel
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Publication number: 20230215660Abstract: A film capacitor includes first and second contact layers and a metallized dielectric film with first and second end faces and with first and second film sides. The first end face of the metallized dielectric film is connected to the first contact layer and the second end face is connected to the second contact layer. The metallized dielectric film has first, second and third metallization layers, with at least two of the metallization layers applied on the first film side of the metallized dielectric film and at least a further of the metallization layers applied on the second film side. The metallization layers are arranged on the film sides in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the metallization layers on the film sides, with the partial capacitances forming a series connection.Type: ApplicationFiled: May 4, 2021Publication date: July 6, 2023Applicant: Siemens AktiengesellschaftInventors: Marion Junghänel, Bernd KÜRTEN, Helmut BRENDEL, Alexander HENSLER, Philipp OSCHMANN, Gerd HILBINGER
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Publication number: 20220407434Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.Type: ApplicationFiled: August 6, 2020Publication date: December 22, 2022Applicant: Siemens AktiengesellschaftInventors: ALEXANDER HENSLER, PHILIPP OSCHMANN, HUBERT SCHIERLING
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Publication number: 20220406682Abstract: An electronic module includes a pulsating heat pipe having a channel structure for arrangement of a heat transport medium. The channel structure is formed of ceramic bodies, a metallic cover element, and a metallic carrier element. An electrical structural element is in contact with the heat transport medium.Type: ApplicationFiled: September 29, 2020Publication date: December 22, 2022Applicant: Siemens AktiengesellschaftInventors: FLORIAN SCHWARZ, ALEXANDER HENSLER, HUBERT SCHIERLING
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Patent number: 11431240Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier. The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.Type: GrantFiled: September 19, 2019Date of Patent: August 30, 2022Assignee: Siemens AktiengesellschaftInventors: Alexander Hensler, Philipp Oschmann
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Patent number: 11431241Abstract: A frequency converter with a rectifier on an input side and a backup capacitor arranged downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The input-side phases are connected to grid-side phases of a multiphase supply grid via a pre-circuit. Each grid-side phase is connected to an input-side phase within the pre-circuit via a phase capacitor. Each grid-side phase is additionally directly connected to another input-side phase within the pre-circuit via a switch and the grid-side phases are short-circuited with the input-side phases when the switches are closed. Each phase capacitor connects two grid-side phases or two input-side phases together. The frequency converter has a control apparatus which keeps the switches open when pre-charging the backup capacitor and closes the switches when a specified charge state of the backup capacitor is reached.Type: GrantFiled: September 19, 2019Date of Patent: August 30, 2022Assignee: Siemens AktiengesellschaftInventors: Alexander Hensler, Hubert Schierling
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Publication number: 20220208643Abstract: An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.Type: ApplicationFiled: June 5, 2020Publication date: June 30, 2022Applicant: Siemens AktiengesellschaftInventors: THOMAS BIGL, ALEXANDER HENSLER, STEPHAN NEUGEBAUER, STEFAN PFEFFERLEIN
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Publication number: 20220006395Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier, The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.Type: ApplicationFiled: September 19, 2019Publication date: January 6, 2022Applicant: SIEMENS AKTIENGESELLSCHAFTInventors: ALEXANDER HENSLER, PHILIPP OSCHMANN
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Publication number: 20220007543Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.Type: ApplicationFiled: October 31, 2019Publication date: January 6, 2022Applicant: SIEMENS AKTIENGESELLSCHAFTInventors: THOMAS BIGL, ALEXANDER HENSLER, STEPHAN NEUGEBAUER, EWGENIJ OCHS, PHILIPP OSCHMANN, STEFAN PFEFFERLEIN, ULRICH WETZEL
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Publication number: 20210408931Abstract: A frequency converter with a rectifier on an input side and a backup capacitor arranged downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The input-side phases are connected to grid-side phases of a multiphase supply grid via a pre-circuit. Each grid-side phase is connected to an input-side phase within the pre-circuit via a phase capacitor. Each grid-side phase is additionally directly connected to another input-side phase within the pre-circuit via a switch and the grid-side phases are short-circuited with the input-side phases when the switches are closed. Each phase capacitor connects two grid-side phases or two input-side phases together. The frequency converter has a control apparatus which keeps the switches open when pre-charging the backup capacitor and closes the switches when a specified charge state of the backup capacitor is reached.Type: ApplicationFiled: September 19, 2019Publication date: December 30, 2021Applicant: SIEMENS AKTIENGESELLSCHAFTInventors: Alexander Hensler, HUBERT SCHIERLING
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Patent number: 10420220Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.Type: GrantFiled: May 2, 2017Date of Patent: September 17, 2019Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Stefan Pfefferlein, Jörg Strogies, Klaus Wilke
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Publication number: 20190191566Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.Type: ApplicationFiled: May 2, 2017Publication date: June 20, 2019Applicant: Siemens AktiengesellschaftInventors: Thomas BIGL, Alexander HENSLER, Stephan NEUGEBAUER, Stefan PFEFFERLEIN, Jörg STROGIES, Klaus WILKE
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Patent number: 10306794Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).Type: GrantFiled: August 8, 2016Date of Patent: May 28, 2019Assignee: Siemens AktiengesellschaftInventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Stefan Pfefferlein
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Publication number: 20180270979Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).Type: ApplicationFiled: August 8, 2016Publication date: September 20, 2018Applicant: Siemens AktiengesellschaftInventors: Thomas Bigl, ALEXANDER HENSLER, STEPHAN NEUGEBAUER, STEFAN PFEFFERLEIN