Patents by Inventor ALEXANDER HENSLER

ALEXANDER HENSLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973434
    Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: April 30, 2024
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alexander Hensler, Philipp Oschmann, Hubert Schierling
  • Publication number: 20240113637
    Abstract: A commutation cell for a flying capacitor module, to a flying capacitor module having the commutation cell and to a multi-level converter having the flying capacitor module is disclosed. The commutation cell includes a circuit board, two semiconductors mounted either on the same side or on opposite sides of the circuit board, four capacitors arranged in pairs on opposite sides of the circuit board, and flying capacitors connected to the input and output sides of the commutation cell, respectively. The capacitors located on opposite sides are connected to one another by way of via holes. Different commutation paths between the various capacitors extend on the first side and on the second side of the circuit board and along the vias, with currents flowing through the respective adjacent capacitors in opposing directions for an overall reduction in the parasitic inductances.
    Type: Application
    Filed: December 21, 2021
    Publication date: April 4, 2024
    Applicant: Siemens Aktiengesellschaft
    Inventors: Raphael Hartwig, ALEXANDER HENSLER
  • Patent number: 11756857
    Abstract: An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: September 12, 2023
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Stefan Pfefferlein
  • Patent number: 11723177
    Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: August 8, 2023
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Ewgenij Ochs, Philipp Oschmann, Stefan Pfefferlein, Ulrich Wetzel
  • Publication number: 20230215660
    Abstract: A film capacitor includes first and second contact layers and a metallized dielectric film with first and second end faces and with first and second film sides. The first end face of the metallized dielectric film is connected to the first contact layer and the second end face is connected to the second contact layer. The metallized dielectric film has first, second and third metallization layers, with at least two of the metallization layers applied on the first film side of the metallized dielectric film and at least a further of the metallization layers applied on the second film side. The metallization layers are arranged on the film sides in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the metallization layers on the film sides, with the partial capacitances forming a series connection.
    Type: Application
    Filed: May 4, 2021
    Publication date: July 6, 2023
    Applicant: Siemens Aktiengesellschaft
    Inventors: Marion Junghänel, Bernd KÜRTEN, Helmut BRENDEL, Alexander HENSLER, Philipp OSCHMANN, Gerd HILBINGER
  • Publication number: 20220407434
    Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.
    Type: Application
    Filed: August 6, 2020
    Publication date: December 22, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: ALEXANDER HENSLER, PHILIPP OSCHMANN, HUBERT SCHIERLING
  • Publication number: 20220406682
    Abstract: An electronic module includes a pulsating heat pipe having a channel structure for arrangement of a heat transport medium. The channel structure is formed of ceramic bodies, a metallic cover element, and a metallic carrier element. An electrical structural element is in contact with the heat transport medium.
    Type: Application
    Filed: September 29, 2020
    Publication date: December 22, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: FLORIAN SCHWARZ, ALEXANDER HENSLER, HUBERT SCHIERLING
  • Patent number: 11431240
    Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier. The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 30, 2022
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alexander Hensler, Philipp Oschmann
  • Patent number: 11431241
    Abstract: A frequency converter with a rectifier on an input side and a backup capacitor arranged downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The input-side phases are connected to grid-side phases of a multiphase supply grid via a pre-circuit. Each grid-side phase is connected to an input-side phase within the pre-circuit via a phase capacitor. Each grid-side phase is additionally directly connected to another input-side phase within the pre-circuit via a switch and the grid-side phases are short-circuited with the input-side phases when the switches are closed. Each phase capacitor connects two grid-side phases or two input-side phases together. The frequency converter has a control apparatus which keeps the switches open when pre-charging the backup capacitor and closes the switches when a specified charge state of the backup capacitor is reached.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 30, 2022
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alexander Hensler, Hubert Schierling
  • Publication number: 20220208643
    Abstract: An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.
    Type: Application
    Filed: June 5, 2020
    Publication date: June 30, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: THOMAS BIGL, ALEXANDER HENSLER, STEPHAN NEUGEBAUER, STEFAN PFEFFERLEIN
  • Publication number: 20220006395
    Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier, The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.
    Type: Application
    Filed: September 19, 2019
    Publication date: January 6, 2022
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: ALEXANDER HENSLER, PHILIPP OSCHMANN
  • Publication number: 20220007543
    Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.
    Type: Application
    Filed: October 31, 2019
    Publication date: January 6, 2022
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: THOMAS BIGL, ALEXANDER HENSLER, STEPHAN NEUGEBAUER, EWGENIJ OCHS, PHILIPP OSCHMANN, STEFAN PFEFFERLEIN, ULRICH WETZEL
  • Publication number: 20210408931
    Abstract: A frequency converter with a rectifier on an input side and a backup capacitor arranged downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The input-side phases are connected to grid-side phases of a multiphase supply grid via a pre-circuit. Each grid-side phase is connected to an input-side phase within the pre-circuit via a phase capacitor. Each grid-side phase is additionally directly connected to another input-side phase within the pre-circuit via a switch and the grid-side phases are short-circuited with the input-side phases when the switches are closed. Each phase capacitor connects two grid-side phases or two input-side phases together. The frequency converter has a control apparatus which keeps the switches open when pre-charging the backup capacitor and closes the switches when a specified charge state of the backup capacitor is reached.
    Type: Application
    Filed: September 19, 2019
    Publication date: December 30, 2021
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Alexander Hensler, HUBERT SCHIERLING
  • Patent number: 10420220
    Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: September 17, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Stefan Pfefferlein, Jörg Strogies, Klaus Wilke
  • Publication number: 20190191566
    Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.
    Type: Application
    Filed: May 2, 2017
    Publication date: June 20, 2019
    Applicant: Siemens Aktiengesellschaft
    Inventors: Thomas BIGL, Alexander HENSLER, Stephan NEUGEBAUER, Stefan PFEFFERLEIN, Jörg STROGIES, Klaus WILKE
  • Patent number: 10306794
    Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: May 28, 2019
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Stefan Pfefferlein
  • Publication number: 20180270979
    Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).
    Type: Application
    Filed: August 8, 2016
    Publication date: September 20, 2018
    Applicant: Siemens Aktiengesellschaft
    Inventors: Thomas Bigl, ALEXANDER HENSLER, STEPHAN NEUGEBAUER, STEFAN PFEFFERLEIN