Abstract: A commutation cell for a flying capacitor module, to a flying capacitor module having the commutation cell and to a multi-level converter having the flying capacitor module is disclosed. The commutation cell includes a circuit board, two semiconductors mounted either on the same side or on opposite sides of the circuit board, four capacitors arranged in pairs on opposite sides of the circuit board, and flying capacitors connected to the input and output sides of the commutation cell, respectively. The capacitors located on opposite sides are connected to one another by way of via holes. Different commutation paths between the various capacitors extend on the first side and on the second side of the circuit board and along the vias, with currents flowing through the respective adjacent capacitors in opposing directions for an overall reduction in the parasitic inductances.

Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.

Abstract: An electronic module includes a pulsating heat pipe having a channel structure for arrangement of a heat transport medium. The channel structure is formed of ceramic bodies, a metallic cover element, and a metallic carrier element. An electrical structural element is in contact with the heat transport medium.

Abstract: An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.

Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier, The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.

Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.

Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).