Patents by Inventor Alexander HUETTIS

Alexander HUETTIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
    Publication number: 20240162134
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 16, 2024
    Inventors: Xiao LU, Jiongxin LU, Christopher COMBS, Alexander HUETTIS, John HARPER, Jieping ZHANG, Nachiket R. RARAVIKAR, Pramod MALATKAR, Steven A. KLEIN, Carl DEPPISCH, Mohit SOOD
  • Varied ball ball-grid-array (BGA) packages
    Patent number: 11916003
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: February 27, 2024
    Assignee: Intel Corporation
    Inventors: Xiao Lu, Jiongxin Lu, Christopher Combs, Alexander Huettis, John Harper, Jieping Zhang, Nachiket R. Raravikar, Pramod Malatkar, Steven A. Klein, Carl Deppisch, Mohit Sood
  • VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
    Publication number: 20210082798
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.
    Type: Application
    Filed: September 18, 2019
    Publication date: March 18, 2021
    Inventors: Xiao LU, Jiongxin LU, Christopher COMBS, Alexander HUETTIS, John HARPER, Jieping ZHANG, Nachiket R. RARAVIKAR, Pramod MALATKAR, Steven A. KLEIN, Carl DEPPISCH, Mohit SOOD