Abstract: The disclosed apparatus may include (1) a cold plate base that (A) is thermally coupled to a component and (B) includes a set of heatsink fin structures that facilitate absorbing heat generated by the component and (2) a cold plate cover that (A) sits atop the cold plate base and (B) directs a cooling fluid across the set of heatsink fin structures to cool the cold plate base despite the heat absorbed by the cold plate base from the component. Various other apparatuses, systems and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) a shoulder bolt that includes (A) a head and (B) a shank, (2) a retention barrel that envelops at least a portion of the shank of the shoulder bolt, (3) a coil spring that envelops at least a portion of the shank of the shoulder bolt and resides between the head of the shoulder bolt and a heatsink, and (4) a travel-limiting component (such as a set screw or a sleeve) that (A) is coupled to the retention barrel and (B) limits the heatsink from travelling linearly beyond a travel threshold via the coil spring. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) a shoulder bolt that includes (A) a head and (B) a shank, (2) a retention barrel that envelops at least a portion of the shank of the shoulder bolt, (3) a coil spring that envelops at least a portion of the shank of the shoulder bolt and resides between the head of the shoulder bolt and a heatsink, and (4) a travel-limiting component (such as a set screw or a sleeve) that (A) is coupled to the retention barrel and (B) limits the heatsink from travelling linearly beyond a travel threshold via the coil spring. Various other apparatuses, systems, and methods are also disclosed.

Abstract: Techniques are described to limit heat transfer from a first electronic component to a second electronic such as by having an aperture in a lid over the second electronic component to form a gap in the conductance of heat from the first electronic component to the second electronic component. A semiconductor electronic package includes a substrate, a first electronic component that is of a first type and that is mounted along a surface of the substrate, a second electronic component that is of a second type different than the first type and that is mounted along the surface of the substrate, and a metallic component that is positioned over the first electronic component and that has an aperture through which the second electronic component is exposed.

Abstract: The disclosed apparatus may include (1) a cold plate base that (A) is thermally coupled to a component and (B) includes a set of heatsink fin structures that facilitate absorbing heat generated by the component and (2) a cold plate cover that (A) sits atop the cold plate base and (B) directs a cooling fluid across the set of heatsink fin structures to cool the cold plate base despite the heat absorbed by the cold plate base from the component. Various other apparatuses, systems, and methods are also disclosed.

Abstract: Techniques are described to limit heat transfer from a first electronic component to a second electronic such as by having an aperture in a lid over the second electronic component to form a gap in the conductance of heat from the first electronic component to the second electronic component. A semiconductor electronic package includes a substrate, a first electronic component that is of a first type and that is mounted along a surface of the substrate, a second electronic component that is of a second type different than the first type and that is mounted along the surface of the substrate, and a metallic component that is positioned over the first electronic component and that has an aperture through which the second electronic component is exposed.

Abstract: Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.

Abstract: The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) a base that (A) supports multiple heatsinks and (B) is coupled to a device that includes (i) a first component designed to operate at temperatures below a first threshold temperature and (ii) a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being different than the second threshold temperature, (2) a first heatsink that (A) is secured to the base and (B) transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature, and (3) a second heatsink that is (A) secured to the base, (B) physically separated from the first heatsink by at least a certain amount of space, and (C) transfers heat away from the second component such that the second component operates at a temperature below the second threshold temperature.

Abstract: The disclosed apparatus may include (1) a base that (A) supports multiple heatsinks and (B) is coupled to a device that includes (i) a first component designed to operate at temperatures below a first threshold temperature and (ii) a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being different than the second threshold temperature, (2) a first heatsink that (A) is secured to the base and (B) transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature, and (3) a second heatsink that is (A) secured to the base, (B) physically separated from the first heatsink by at least a certain amount of space, and (C) transfers heat away from the second component such that the second component operates at a temperature below the second threshold temperature.

Abstract: The disclosed apparatus may include (1) a housing unit that houses an optical transducer within a telecommunications device, (2) a heatsink that is coupled to a movable shaft secured to a joint within the telecommunications device, and (3) a coil spring that (A) is coupled to the movable shaft secured to the joint within the telecommunications device and, when released, (B) applies a force that presses the heatsink against the optical transducer to ensure that the heatsink is thermally coupled to the optical transducer. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include a fluid-cooled plate that may be thermally coupled to a first electronic component for cooling the first electronic component by way of a cooling fluid, and a gas-cooled plate physically coupled to the fluid-cooled plate. The gas-cooled plate may be thermally coupled to a second electronic component for cooling the second electronic component by way of a gas. The gas-cooled plate may be separated from the fluid-cooled plate by a gap. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) a first heatsink that is coupled to a first component of a multichip module, (2) a second heatsink that is (A) coupled to a second component of the multichip module and (B) physically separated from the first heatsink by at least a certain amount of clearance, and (3) a coil spring that (A) encompasses the second heatsink, (B) resides within the certain amount of clearance that separates the first and second heatsinks from one another, and (C) prevents at least some electromagnetic radiation from leaking via the certain amount of clearance that separates the first and second heatsinks from one another. Various other apparatuses, systems, and methods are also disclosed.

Abstract: Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the air outlet. The air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet. The computer systems also include a heat exchanger positioned between two adjacent computer module compartments. The heat exchanger includes a plurality of heat exchange elements canted relative to the air flow path.

Abstract: Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the air outlet. The air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet. The computer systems also include a heat exchanger positioned between two adjacent computer module compartments. The heat exchanger includes a plurality of heat exchange elements canted relative to the air flow path.

Abstract: Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the air outlet. The air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet. The computer systems also include a heat exchanger positioned between two adjacent computer module compartments. The heat exchanger includes a plurality of heat exchange elements canted relative to the air flow path.

Abstract: Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.

Abstract: Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.

Abstract: Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the air outlet. The air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet. The computer systems also include a heat exchanger positioned between two adjacent computer module compartments. The heat exchanger includes a plurality of heat exchange elements canted relative to the air flow path.