Abstract: A multilayered switching structure is disclosed for the development and the production of an apparatus based on microelectronic components and semiconductor devices. The structure may widely be used in the production of multilayered printed circuit cards and switching structures for monocrystalline modules. The multilayered switching structure includes a plurality of layers of a dielectric material which include electroconductive tracks on their surfaces and which consist of switching layers. This structure also includes contact nodes consisting of metallized contacts which are aligned with each other and which are electrically and mechanically connected together by an electroconductive binding material. The contact nodes are made in the form of splices arranged between the contacts. In a second embodiment, the multilayered switching plate includes electroconductive tracks provided on both sides of each switching layer and are connected together within the limits of each layer by metallized junction openings.