Abstract: A soldering nozzle for delivering molten solder to the underside of a PCB. The nozzle comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle of the present invention achieves an improved dewetting performance.

Abstract: The present invention provides an improved soldering nozzle (61, 81) for delivering molten solder to the underside of a PCB. The nozzle (61, 81) comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle (61, 81) having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle (61, 81) comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle (61, 81) of the present invention achieves an improved dewetting performance.

Abstract: Solder is pumped through a nozzle to produce a jet 12 of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle 2 is mounted on a flange 16 held between slip rings 18, 20 so that the nozzle can be rotated to change the direction of the jet. A nitrogen conduit 68, 70 may be provided in-line with the jet to provide a nitrogen atmosphere. A thin plate 92 downstream of the nozzle outlet to contact the jet and inhibit sideways fluctuations when leads are passed sideways through the jet. The apparatus may also include a tube 204, 212, 224 for delivering heated nitrogen gas to pre-heat a region to be soldered.

Abstract: Solder is pumped through a nozzle to produce a jet of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle is mounted on a flange held between slip rings so that the nozzle can be rotated to change the direction of the jet. A nitrogen conduit may be provided in-line with the jet to provide a nitrogen atmosphere. A thin plate downstream of the nozzle outlet to contact the jet and inhibit sideways fluctuations when leads are passed sideways through the jet. The apparatus may also include a tube for delivering heated nitrogen gas to pre-heat a region to be soldered.

Abstract: In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form solder bridges between closely spaced leads.

Abstract: In a soldering apparatus using a rotary station, a component holder is lowered and/or moved vertically by a stepper motor drive. A motor, lowers a drive shaft by a lead screw, and a second motor rotates the shaft via a toothed bearing wheel, the shaft having a hexagonal cross-section. A pivotable lobe couples the shaft to a shaft to lower the component holder and to rotate it (by rotation of shaft). The stepper motors allow for variable speed of vertical movement of the component holder and for selective rotation.

Abstract: In a dip soldering apparatus, a first scraper blade scrapes the surface of the solder bath before a pot is raised through the surface of the bath, and a second blade then scrapes the surface of solder in the pot when the pot has been lifted through the surface. The blades are swept around in a circle to facilitate operation of the device. A rotary station for feeding components to the soldering apparatus comprises a rotatable table carrying a plurality of pneumatically operated stations to index them sequentially through operating positions. The air supply lines, for pneumatic control and operation of each station, are discrete to the respective operating positions and so it is not necessary to provide a system of supply lines which rotate with the stations. An end of a supply line is sealed to a conduit in the table by a PTFE sealing member which has an inwardly directed, tapered lip. As air pressure in the line is increased (to operate the station) the lip is urged against the underside of the table.

Abstract: In a skeining device for skeining wire fed to a coil winding apparatus, a shuttle member loops the wire around front and rear retaining members and the loops are then twisted to form the skein. The wire is under greatest tension when being pulled from the rear retaining member to the front retaining member and so the shuttle member is driven at a slower speed during this part of the skeining operation. Also, the shuttle member is reversible along its path to allow optimum positioning of the shuttle when twisting the skein and when wire passes rapidly through the device during coil winding.

Abstract: In a method and apparatus for soldering or tinning wires or component leads, solder is pumped through a nozzle to form a downwardly flowing stream. The wire or lead is passed laterally into the stream and then withdrawn axially to leave a coating of solder on the wire. The wire or lead is angled to the horizontal, pointing upwardly in the direction of withdrawal from the stream.

Abstract: A surface mounted chip soldering apparatus comprises a number of stations for fluxing and soldering the chip. For each station, the chip is carried by a suction pad in which is created a partial vacuum by a respective piston and cylinder mounted on a turret. The piston is upwardly spring biassed and operated in time and in sequence by pneumatically operated pistons to hold and to reject the chips as required for carrying out a soldering sequence.

Abstract: A soldering apparatus includes a solder bath 40 and a component holder 43 positioned to lower an exposed tag of a component to contact solder in the solder bath 40. After removal from the bath the component is deliberately subjected to a mechanical shock when a limb of a bracket 44 strikes a turret plate 42 under the action of a spring 46. The shock causes a short time vibration in the component and spreads solder in tears which naturally form on the exposed tags to remove or substantially reduce those tears.

Abstract: In a soldering apparatus a pump pumps molten solder up into a tube to form a head of molten solder. Solder is fed from the tube through a conduit to a nozzle for a soldering operation. The pump comprises a rotatable shaft extending within the tube and an air tight seal is formed between the shaft and tube, above the level of the solder, to reduce the formation of dust of oxidized solder at the region of shear between the shaft and the solder surface.

Abstract: A soldering apparatus comprises a solder bath, an applicator for applying solder to a joint or the like to be soldered and a pump for pumping solder substantially continuously through the applicator. The applicator is movable vertically relative to the solder bath to solder a joint positioned above the bath.

Abstract: A fly winder capable of high speed operation comprises a hollow rotatable axially stationary flier and a rotationally stationary bobbin support concentric with the flier and axially reciprocable towards and away from an open end of the flier, the hollow interior of the flier being conical (that is to say stepless) and forming a wire guide, the greater diameter end of the hollow interior being disposed adjacent to the bobbin support and being of diameter such that a bobbin mounted on the support can be received therein, an eyelet being mounted on the flier at the greater diameter end of the cone and through which the wire is constrained to pass before being wound on the bobbin. Thus the wire enters the cone substantially on the axis of rotation of the flier and is free to assume its own position in the wire guide, which in practice tends to be a helix.