Abstract: An assembly and method provides improved electromagnetic interference shielding, particularly where the assembly includes a shield with a shield opening. The shield opening may be provided to permit the escape of thermal energy from an electronic component on a substrate under the shield or to receive at least a part of a thermal pad, electronic component, or conductive chassis. The assembly includes a first conductive gasket disposed around the shield opening, and a second conductive gasket disposed radially outward from the first conductive gasket. The first conductive gasket and the second conductive gasket have one or more gasket characteristics including a respective first characteristic and second characteristic that are of the same type but have different values. The first characteristic and the second characteristic may be one or more of different attenuation frequency ranges, compression amounts, compressive forces, and dimensions.

Abstract: An assembly and method provides improved electromagnetic interference shielding, particularly where the assembly includes a shield with a shield opening. The shield opening may be provided to permit the escape of thermal energy from an electronic component on a substrate under the shield or to receive at least a part of a thermal pad, electronic component, or conductive chassis. The assembly includes a first conductive gasket disposed around the shield opening, and a second conductive gasket disposed radially outward from the first conductive gasket. The first conductive gasket and the second conductive gasket have one or more gasket characteristics including a respective first characteristic and second characteristic that are of the same type but have different values. The first characteristic and the second characteristic may be one or more of different attenuation frequency ranges, compression amounts, compressive forces, and dimensions.