Patents by Inventor Alexander J. Swinton

Alexander J. Swinton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
    Patent number: 6258710
    Abstract: A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: July 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du B. Nguyen, Richard G. Smith, Alexander J. Swinton, Richard A. Wachnik
  • Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
    Patent number: 6069068
    Abstract: A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.
    Type: Grant
    Filed: October 8, 1997
    Date of Patent: May 30, 2000
    Assignee: International Business Machines Corporation
    Inventors: Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du B. Nguyen, Richard G. Smith, Alexander J. Swinton, Richard A. Wachnik
  • Multiple device test layout
    Patent number: 6037795
    Abstract: A test layout increases the sample size of electromigration experiments. Through pad sharing, the number of structures tested can be increased, allowing hundreds of identical structures to be tested in a single high temperature oven door.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: March 14, 2000
    Assignee: International Business Machines Corporation
    Inventors: Ronald G. Filippi, James J. Poulin, Robert D. Raviart, Kenneth P. Rodbell, Richard G. Smith, Timothy D. Sullivan, Alexander J. Swinton