Patents by Inventor Alexander James Elliott

Alexander James Elliott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin GaAs die with copper back-metal structure
    Patent number: 6870243
    Abstract: A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate with a copper back-metal layer, the GaAs Substrate can be made thinner than 2 mils (about 50 microns), thereby reducing heat dissipation problems and allowing the semiconductor die to be compatible with soft-solder technologies. By enabling the semiconductor die to be packaged in a plastic package substantial cost savings can be achieved.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 22, 2005
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Alexander James Elliott, Jeffrey Dale Crowder, Monte Gene Miller
  • Thin GaAs die with copper back-metal structure
    Publication number: 20040099932
    Abstract: A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate with a copper back-metal layer, the GaAs Substrate can be made thinner than 2 mils (about 50 microns), thereby reducing heat dissipation problems and allowing the semiconductor die to be compatible with soft-solder technologies. By enabling the semiconductor die to be packaged in a plastic package substantial cost savings can be achieved.
    Type: Application
    Filed: November 27, 2002
    Publication date: May 27, 2004
    Applicant: Motorola, Inc.
    Inventors: Alexander James Elliott, Jeffrey Dale Crowder, Monte Gene Miller