Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: A component carrier with an integrated magnetic field sensor is disclosed. The component carrier includes a plurality of electrically conductive layer structures and/or electrically insulating layer structures; an excitation coil and sensor coils arranged on and/or in the layer structures; a first magnetic structure above the excitation coil and sensor coils; and a second magnetic structure below the excitation coil and sensor coils.

Abstract: A component carrier for carrying an electronic component on and/or in the component carrier, wherein the component carrier includes an interconnected stack composed of a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures, wherein at least part of at least one of the electrically conductive layer structures is configured as at least part of an integrated strain gauge configured for detecting strain exerted on at least part of the component carrier.

Abstract: A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier.

Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: A component carrier with an integrated magnetic field sensor is disclosed. The component carrier includes a plurality of electrically conductive layer structures and/or electrically insulating layer structures; an excitation coil and sensor coils arranged on and/or in the layer structures; a first magnetic structure above the excitation coil and sensor coils; and a second magnetic structure below the excitation coil and sensor coils.

Abstract: A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier.

Abstract: A component carrier for carrying an electronic component on and/or in the component carrier, wherein the component carrier includes an interconnected stack composed of a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures, wherein at least part of at least one of the electrically conductive layer structures is configured as at least part of an integrated strain gauge configured for detecting strain exerted on at least part of the component carrier.

Abstract: The invention relates to a printed circuit board structure with at least one dielectric insulating layer and at least one conductive layer, in which within the at least one insulating layer, a layer made of a dielectric thermally conductive material is provided that is located at least in the vicinity of, or in contact with, an inner conductor arrangement. Another thermally conductive layer, preferably an electrically conductive metal layer, can be provided in the immediate vicinity of, or in contact with, the layer made of a dielectric thermally conductive material. It is also possible for an at least thermally conductive, preferably electrically conductive feedthrough to pass from a conductor section lying on the outside of the printed circuit board into the inside of the printed circuit board, at least into the vicinity of the layer made of a dielectric thermally conductive material.

Abstract: In a connection panel for electronic components comprising a plurality of insulating layers and conductive layers and further comprising an electronic sensor, the sensor is comprised of at least one flexure member formed by a flexure layer, the flexure member protruding from the flexure layer and into a clearance within the flexure layer and carrying at least a part of a flexure sensing device.

Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Abstract: The invention relates to a circuit board element (1) comprising a substrate (2), on which at least one dielectric layer (7) is arranged, and at least one LED (light-emitting diode) (10), wherein at least one channel-shaped waveguide cavity (11) leading away from the LED (10) is provided in the dielectric layer (7), which waveguide cavity leads to at least one integrated light-sensitive component (12), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the LED (10) is preferably also arranged in a cavity (9) that is connected to the waveguide cavity (11). The invention further relates to a method for producing such a circuit board element (1).

Abstract: A commutation cell having at least one electrical capacitor, at least one controllable semiconductor switch and at least one semiconductor which is connected in series with the controllable semiconductor switch. The commutation cell has three circuit substrates situated in parallel with one another. The controllable semiconductor switch is connected in series with the semiconductor via a circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, and the two remaining circuit substrates being connected to one another in an electrically conductive manner via a subassembly made up of the controllable semiconductor switch, the semiconductor and the circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, the electrical capacitor being switched between the two remaining circuit substrates, separately from the subassembly.

Abstract: A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1?) and application of a dielectric insulating foil (3, 3?) to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4?) to the insulating layer (3, 3?); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1?) plus insulating layer (3, 3?) and conducting paths (4, 4?) by interposing a prepreg layer (5, 85; 18, 18?), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.

Abstract: A commutation cell having at least one electrical capacitor, at least one controllable semiconductor switch and at least one semiconductor which is connected in series with the controllable semiconductor switch. The commutation cell has three circuit substrates situated in parallel with one another. The controllable semiconductor switch is connected in series with the semiconductor via a circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, and the two remaining circuit substrates being connected to one another in an electrically conductive manner via a subassembly made up of the controllable semiconductor switch, the semiconductor and the circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, the electrical capacitor being switched between the two remaining circuit substrates, separately from the subassembly.

Abstract: The invention relates to a printed circuit board structure with at least one dielectric insulating layer and at least one conductive layer, in which within the at least one insulating layer, a layer made of a dielectric thermally conductive material is provided that is located at least in the vicinity of, or in contact with, an inner conductor arrangement. Another thermally conductive layer, preferably an electrically conductive metal layer, can be provided in the immediate vicinity of, or in contact with, the layer made of a dielectric thermally conductive material. It is also possible for an at least thermally conductive, preferably electrically conductive feedthrough to pass from a conductor section lying on the outside of the printed circuit board into the inside of the printed circuit board, at least into the vicinity of the layer made of a dielectric thermally conductive material.